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| 型號(hào)： | 101-1226 |
| 廠商： | Rabbit Semiconductor |
| 文件頁數(shù)： | 158/168頁 |
| 文件大?。?/td> | 0K |
| 描述： | RCM3900 DEV KIT UNIVERSAL |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | RabbitCore 3900 |
| 類型： | MPU 模塊 |
| 適用于相關(guān)產(chǎn)品： | RCM3900 |
| 所含物品： | RabbitCore 模塊、開發(fā)板、交流適配器、纜線和 Dynamic C? 光盤 |
| 其它名稱： | 316-1137 |
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RabbitCore RCM3900 User’s Manual
9
1.2 Comparing the RCM3365/RCM3375 and the RCM3900/RCM3910
Temperature Specifications
— We can no longer obtain certain components for the
RCM3365/RCM3375 RabbitCore modules that support the -40°C to +70°C temperature
range. RCM3365/RCM3375 RabbitCore modules manufactured after May, 2008, are
specified to operate at 0°C to +70°C. The RCM3900/RCM3910, rated for -20°C to
+85°C, are available after May, 2008.
Removable Mass Storage
— The hot-swappable xD-Picture Card mass storage
device with up to 128MB of memory has been replaced with the SD Card with up to
1GB of memory. The SD Card is more readily available today, and is expected to
remain readily available for a long time. In addition, SD Cards provide a significantly
larger memory capacity, which has been requested by customers. The trade-off for the
larger memory capacity is that the data transfer rate to/from the SD Card is about an
order of magnitude slower than to/from the xD-Picture Card.
NOTE: RCM3365/RCM3375 RabbitCore modules may eventually be discontinued
because of changes to the xD-Picture Card. The
miniSD Card card initially used
with the RCM3900 series has since been replaced by the
microSD Card. Aside
from using a different sized memory card, the boards function the same.
Serial Ports
— Serial Port B, available as either a clocked serial port or an asynchro-
nous serial port on the RCM3365/RCM3375, is used by the RCM3900/RCM3910 as a
clocked serial peripheral interface (SPI) for the microSD Card, and is not brought out
for customer use.
General-Purpose I/O
— PD2, a configurable I/O pin on the RCM3365/RCM3375, is
used to detect whether the microSD Card is installed on the RCM3900/RCM3910,
and so PD2 is not brought out for customer use on the RCM3900/RCM3910.
Maximum Current
— The RCM3365/RCM3375 draws 250 mA vs. the 325 mA
required by the RCM3900/RCM3910.
LEDs
— The SPEED and user (USR/BSY)LED locations have been swapped between
the RCM3365/RCM3375 and the RCM3900/RCM3910, the LNK/ACT LEDs have
been combined to one LED on the RCM3900/RCM3910, and the RCM3900/RCM3910
has an FDX/COL LED instead of the FM LED on the RCM3365/RCM3375. The LED
placements on the boards remain unchanged.
Ethernet chip
— A different Ethernet controller chip is used on the RCM3900. The
Ethernet chip is able to detect automatically whether a crossover cable or a straight-
through cable is being used in a particular setup, and will configure the signals on the
Ethernet jack interface.
Dynamic C
— As long as no low-level FAT file system calls or direct xD-Picture Card
access calls to the NFLASH.LIB library were used in your application developed for the
RCM3365/RCM3375, you may run that application on the RCM3900/RCM3910 after
you recompile it using Dynamic C v. 9.62.
NOTE: The Dynamic C RabbitSys option for programming an RCM3365 over an
Ethernet link is not supported for the RCM3900.
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