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參數(shù)資料
| 型號： | 1-770193-0 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
| 中文描述： | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 1407K |
| 代理商： | 1-770193-0 |
te.com/powerconnectors
2-Piece Power Connectors
TE Connectivity
Application: Backplanes
PRODUCTS
Amps/Linear Inch
Universal Power Module
MULTIGIG RT
ICCON
MINIPAK HDE
Stacked ICCON
< 125
l
125 – 175
l
175 – 225
l
> 225
l
Universal Power Module (UPM)
Connectors (Slim UPM shown)
Varieties of UPM include: standard,
high current, slim, low profile
2 performance levels
Standard 10 amp contact
High current 16 Amp contacts
True hot-plug contacts
High reliability — up to 250 cycles
Different configurations include right
angle, vertical, coplanar and mezzanine
Reference Part Numbers*
1903977-1 (Slim UPM), 1645498-2
(Vertical Plug), 5646954-2 (R/A Plug)
MULTIGIG RT Connectors
2 mm backplane connectors
20 Amp contacts
Three contact mating lengths are
available in 1.5 mm sequence levels
1 and 2 row versions to provide maximum
trace routing flexibility
True hot-plug contacts
Reference Part Numbers*
1-1410271-1 (Plug)
1410270-2 (Receptacle)
ICCON Connectors
With and without locking feature
35A current rating
Slimline version available, 30% smaller
footprint
Board-to-board, board–to-busbar, and
wire-to-board application options
Durable, quick connect/disconnect
function for high current space
constrained applications
Reference Part Numbers*
6643274-1 (Vertical Pin),
6643228-1 (R/A Pin),
6643220-1 (SLIMLINE Socket)
MINIPAK HDE Connectors
Designed to compliment other backplane
connectors offered by TE including
Z-PACK HM-Zd, Z-PACK TinMan and
other connectors
Very high current density — 18 Amps
per contact, over 250 Amps/linear inch
Two levels of contact sequencing for
mate-first-break-last operation
Reference Part Numbers*
1926226-1 (2x6), 1926229-1 (2x9)
Stacked ICCON Connector
Very High Current Density — Up to
200 Amps per inch
Occupies less PCB edge space than
separate ICCON power and guide
modules
Designed to compliment Z-PACK and
other backplane connectors
Right angle connector to mate
motherboard-to-daughterboard
power distribution systems
Ground pin, power pin and
mate-first-break-last pin options
Reference Part Numbers*
2085181-1 (R/A Socket)
1766663-1 (Vertical Pin)
te.com/products/minipakhde
*Part numbers listed are examples of some available samples, please visit website for additional and mating part numbers.
te.com/products/iccon
te.com/products/upm
te.com/products/iccon
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PDF描述 |
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| 1-770246-0 | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
| 1-770247-0 | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
| 1-770248-0 | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
| 1-770252-0 | .250" C/L, 600 V, 19 A max., Contact True Position Assurance (Universal MATE–N–LOK II) |
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