參數(shù)資料
型號： 1-5103311-2
廠商： Tyco Electronics
元件分類： 矩形連接器
英文描述： AMP–LATCH Pin and Pinless Headers
中文描述： 插針及無插針針座（AMP–LATCH）
文件頁數(shù)： 53/96頁
文件大?。?/td> 3917K
代理商： 1-5103311-2
141
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
AMPMODU Stacking Connectors—Shrouded,
.025 x .025 [0.64 x 0.64] Posts
AMPMODU Interconnection System
Shrouded
Stacking
Headers
5
Product Facts
■ Parallel PC board stacking
without use of mother boards
■ Provides space between
boards for interference-free
routing of wire-to-board
connections
■ Two header heights
available: .785 [19.94] and
1.200 [30.48]
■ Vertical mount headers are
fully shrouded
■ Receptacle contacts have
dual cantilever beams with
built-in overstress protection
■ .025 [0.64] sq. posts and
receptacle contacts on
double-row, .100 x .100
[2.54 x 2.54] centers
■ Header posts and receptacle
contacts are phosphor
bronze, duplex plated
■ Housings are made of
flame retardant, glass-filled
thermoplastic
AMPMODU stacking
connectors are a two-piece
interconnection system
designed for parallel
stacking printed circuit
boards, without the use of
mother boards.
Vertical mount headers and
receptacle assemblies
feature duplex plated posts
and receptacle contacts on
a double-row, .100 x .100
[2.54 x 2.54] grid. The .025
[ 0.64] sq. header posts are
more protected, and the
top-entry receptacle
contacts utilize the proven
AMPMODU receptacle
contact design; dual
cantilever beams with built-
in overstress protection.
Headers are available in
two heights: .785 [19.94]
and 1.200 [30.48]. This
allows the customer to
use the height of the header
to keep wire-to-board
connections up and
away from other board
components, particularly if
the components are densely
packaged around the
header.
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