參數(shù)資料
型號: 1-104891-0
廠商: Tyco Electronics
元件分類: SMT連接器& FFC/FPC
英文描述: .050 Inch AMPMODU 50/50 Grid
中文描述: .050 英寸 AMPMODU 50/50 連接器系統(tǒng)
文件頁數(shù): 6/24頁
文件大?。?/td> 2848K
代理商: 1-104891-0
14
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Board-to-Board Vertical Receptacles and Headers
AMPMODU Interconnection System
Board-to-Board
V
e
rtical
Receptacles
and
Headers
2
Product Facts
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
Non-Protrusive
Metallic Holddowns
.250±.006
[6.35±0.15]
.320±.006
[8.13±0.15]
.390±.006
[9.91±0.15]
R
相關(guān)PDF資料
PDF描述
1-487937-0 .050 X .100 AMPMODU System 50 (Cable)
1-487937-2 .050 X .100 AMPMODU System 50 (Cable)
1-487937-4 .050 X .100 AMPMODU System 50 (Cable)
1-487937-6 .050 X .100 AMPMODU System 50 (Cable)
1-487938-2 .050 X .100 AMPMODU System 50 (Cable)
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