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參數(shù)資料
| 型號(hào)： | 0CANH-002-XTD |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 網(wǎng)絡(luò)接口 |
| 英文描述： | DATACOM, INTERFACE CIRCUIT, PDSO8 |
| 封裝： | 0.150 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁數(shù)： | 5/13頁 |
| 文件大小： | 573K |
| 代理商： | 0CANH-002-XTD |
AMIS-30660 High-Speed CAN Transceiver
Data Sheet
Table 7: Soldering
Soldering Method
Package
Wave
Reflow (1)
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP,
HTSSOP, SMS
Not suitable (2)
Suitable
PLCC (3) , SO, SOJ
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
Notes:
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
2.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3.
If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
5.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
11.0 Company or Product Inquiries
For more information about AMI Semiconductor’s high-speed CAN transceivers, send an email to: auto_assp@amis.com.
For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not
recommended without additional processing by AMIS for such applications. Copyright 2007 AMI Semiconductor, Inc.
13
AMI Semiconductor
– M-20682-003, Jun 07
www.amis.com
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 0CANH-002-XTP | DATACOM, INTERFACE CIRCUIT, PDSO8 |
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| 0D8148-1 | 150 A, MODULAR TERMINAL BLOCK, 1 DECK |
| 0D82410 | 150 A, MODULAR TERMINAL BLOCK, 1 DECK |
| 08144 | 150 A, MODULAR TERMINAL BLOCK, 1 DECK |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 0CANH-002-XTP/AMIS30660 | 制造商:ON Semiconductor 功能描述: |
| 0CANM-001-XTD | 制造商:Rochester Electronics LLC 功能描述: 制造商:AppliedMicro 功能描述: 制造商:ON Semiconductor 功能描述: |
| 0CANN-001-XTD | 制造商:Rochester Electronics LLC 功能描述: 制造商:AppliedMicro 功能描述: 制造商:ON Semiconductor 功能描述: |
| 0CAS020.H | 制造商:Littelfuse 功能描述:Yel indicating automotive fuse,20A 32V |
| 0CB-500 | 制造商:MISCELLANEOUS 功能描述: |
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