參數(shù)資料
型號: 09061487951
元件分類: 連接器件
英文描述: 48 CONTACT(S), MALE, RIGHT ANGLE TWO PART EURO CONNECTOR, SOLDER
文件頁數(shù): 6/13頁
文件大小: 943K
代理商: 09061487951
05
.
02
SMC
Introduction of the Pin in Hole Intrusive Reflow Process
The continuing trend towards miniaturisation
has revolutionised the assembly of electronic
components.
For
the
past
15
years,
most
components
have
been
secured
directly
to
the pcb surface by means of Surface Mount
Technology (SMT). By dispensing with drilled
holes on the pcb, a space saving of up to 70
percent is achieved.
Today, typical components such as resistors, ICs,
capacitors, and connectors with straight terminal pins
are almost exclusively fitted using SMD (Surface
Mount Device) technology in mass production. In
contrast, angled SMD connectors at the edge of the
board have not been successful because of tolerance
problems (co-planarity) and stresses during mating.
Modified solder connectors for assembly with "Pin in
Hole Intrusive Reflow" process offer a better solution.
These can be mounted at low cost, utilising existing
SMD production lines.
“Pin in Hole Intrusive Reflow”
In this process, the connector is inserted into plated
through holes in a comparable way to conventional
component mounting. All other components can be
assembled on the pcb surface.
The components are positioned using pick-and-place
machines. These automatic assembly machines differ
according to whether the components are small,
lightweight or bulky. Connectors are considered bulky
(odd form) because of their comparatively heavy
Fig. 1:
SMT board with connector for
"Pin in Hole Intrusive Reflow" assembly
Fig. 2:
Pick-and-place machine for
odd form components
(Courtesy of JOT Automation GmbH)
weight and large volume which makes them more
difficult to grip. Furthermore, machines for odd form
components must have higher insertion power to fit
the components into pcb holes, which are filled with
solder paste. As a rule, modern SMC production lines
are equipped with both types of machine, therefore
the "Pin in Hole Intrusive Reflow" process generally
entails no extra investment costs for the user.
Conventional assembly process:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
connector at the board edge
6. Quality inspection
“Pin in Hole Intrusive Reflow” assembly:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
connector at the board edge
6. Quality inspection
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