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參數(shù)資料
| 型號： | 0826B50-100J |
| 廠商： | ANAREN INC |
| 元件分類： | 射頻變壓器 |
| 英文描述： | 800 MHz - 2600 MHz RF TRANSFORMER |
| 文件頁數(shù)： | 1/12頁 |
| 文件大?。?/td> | 725K |
| 代理商： | 0826B50-100J |
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model 0826B50-100J
Rev A
Ultra Low Profile 0805 Balun
50 to 200 Balanced
Description
The 0826B50-100J is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering the GSM, DCS,
PCS, UMTS, CDMA and 802.11 b+g+n frequencies. The 0826B50-100J is ideal for
high volume manufacturing and is higher performance than traditional ceramic, and
lumped element baluns. The 0826B50-100J has an unbalanced port impedance of
50
and a 200 balanced port impedance**. This transformation enables single
ended signals to be applied to differential ports on modern integrated chipsets. The
output ports have equal amplitude (-3dB) with 180 degree phase differential. The
0826B50-100J is available on tape and reel for pick and place high volume
manufacturing.
Detailed Electrical Specifications*: Specifications subject to change without notice.
ROOM (25
°C)
Parameter
Min.
Typ.
Max
Unit
Frequency
800
2600
MHz
Unbalanced Port Impedance
50
Balanced Port Impedance**
100
Return Loss
10
13
dB
Insertion Loss***
1.1
1.3
dB
Amplitude Balance
±0.5
±0.8
dB
Phase Balance
±4
±8
Degrees
Power Handling
0.5
Watts
Thermal Resistance
TBD
C / Watt
Features:
800 – 2600 MHz
0.7mm Height Profile
50 Ohm to 2 x 100 Ohm
GSM/DCS/PCS/UMTS/CDMA
Low Insertion Loss
Low Power
Input to Output DC Isolation
Surface Mountable
Tape & Reel
Non-conductive Surface
Operating Temperature
-55
+85
C
*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50
nominal impedance.
** 50
reference to ground. *** Insertion Loss stated at room temperature (1.5 dB Max at +85 C)
Pin Configuration
Balun Pin Configruation
λ 4
The internal configuration of the ultra-low profile balun is diagramed to
the left; the unbalanced port is terminated in an open-circuit and the
two balanced ports are connected to ground. The ground connection
for the two balanced ports are connected together and brought out on
a common pin of the balun. This pin is labeled “DC/RF ground”. For
many chipset applications there is an opportunity to use this
configuration as a single bias point if applicable.
The use of differential circuits is increasing in highly integrated circuits,
because of its inherent noise immunity properties. Differential circuits
have superior performance when looking at properties like cross
coupling, immunity to external noise sources and power supply noise.
When designing power amplifiers differential circuits also help
minimize 2
nd and 3rd order intermodulation products.
The construction of the ultra-low profile balun is bonded multi-layered
stripline made of low loss dielectric material with plated through vias
connecting the internal circuitry to the external printed circuit board,
similar to that of other Xinger
hybrids and directional couplers
.
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