參數(shù)資料
型號(hào): 08051A100J-MR
英文描述: CAP. 10PF MINIREEL 500PCS
中文描述: 第。 10PF MINIREEL 500件
文件頁(yè)數(shù): 9/12頁(yè)
文件大小: 344K
代理商: 08051A100J-MR
41
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
Pad overlap 0.5mm beneath component.
Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
D1
D2
D3
D4
D5
Case Size
D1
D2
D3
D4
D5
0402
1.70 (0.07)
0.60 (0.02)
0.50 (0.02)
0.60 (0.02)
0.50 (0.02)
0603
2.30 (0.09)
0.80 (0.03)
0.70 (0.03)
0.80 (0.03)
0.75 (0.03)
0805
3.00 (0.12)
1.00 (0.04)
1.25 (0.05)
1206
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
1.60 (0.06)
1210
4.00 (0.16)
1.00 (0.04)
2.00 (0.09)
1.00 (0.04)
2.50 (0.10)
1808
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
2.00 (0.08)
1812
5.60 (0.22)
1.00 (0.04))
3.60 (0.14)
1.00 (0.04)
3.00 (0.12)
1825
5.60 (0.22)
1.00 (0.04)
3.60 (0.14)
1.00 (0.04)
6.35 (0.25)
2220
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
5.00 (0.20)
2225
6.60 (0.26)
1.00 (0.04)
4.60 (0.18)
1.00 (0.04)
6.35 (0.25)
Dimensions in millimeters (inches)
REFLOW SOLDERING
相關(guān)PDF資料
PDF描述
08051A101J-MR CAP. 100PF MINIREEL 500PCS
08051A220J-MR CAP. 22PF MINIREEL 500PCS
08051A221J-MR CAP. 220PF MINIREEL 500PCS
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08051A331J-MR CAP. 330PF MINIREEL 500PCS
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