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參數(shù)資料
| 型號(hào)： | 0736590002 |
| 廠商： | MOLEX INC |
| 元件分類： | 電源輸入模塊 |
| 英文描述： | 12 CONTACT(S), FEMALE, POWER CONNECTOR, SOLDER, RECEPTACLE |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 35K |
| 代理商： | 0736590002 |
This document was generated on 11/06/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Overview:
Description:
2.00mm (.079") Pitch HDM Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 12 Circuits, Gold (Au) 0.76m (30")
Documents:
General
Product Family
Backplane Connectors
Series
Application
Backplane
Comments
Midplane Power Module
Component Type
Power Header
Overview
HDM®
Product Name
HDM
Style
N/A
Physical
Circuits (Loaded)
12
Circuits (maximum)
12
Color - Resin
Black
Durability (mating cycles max)
250
First Mate / Last Break
No
Guide to Mating Part
No
Keying to Mating Part
None
Material - Metal
Beryllium Copper
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
Number of Columns
1
Number of Pairs
Open Pin Field
Number of Rows
3
Orientation
Vertical
PC Tail Length (in)
0.098 In
PC Tail Length (mm)
2.50 mm
PCB Locator
No
PCB Retention
Yes
PCB Thickness Recommended (in)
0.098 In
PCB Thickness Recommended (mm)
2.50 mm
Packaging Type
Tube
Pitch - Mating Interface (in)
0.079 In
Pitch - Mating Interface (mm)
2.00 mm
Pitch - Term. Interface (in)
0.079 In
Pitch - Term. Interface (mm)
2.00 mm
Plating min: Mating (in)
30
Plating min: Mating (m)
0.75
Plating min: Termination (in)
150
Plating min: Termination (m)
3.75
Polarized to PCB
No
Stackable
No
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
-55°C to +105°C
Termination Interface: Style
Through Hole
Series image - Reference only
ELV and RoHS
Compliant
Not Reviewed
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73659 Series
Mates With
73651 HDM Board-to-Board
Daughterboard Power Module
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| 0736590003 | 12 CONTACT(S), FEMALE, POWER CONNECTOR, SOLDER, RECEPTACLE |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 0736590003 | 功能描述:2MM HDM BP PW ST3.0 30AU GF 3CKT RoHS:是 類別:連接器，互連式 >> 背板 - 專用 系列:HDM® （高密度） 73659 標(biāo)準(zhǔn)包裝:260 系列:Impact™ 76155 連接器用途:中平面 連接器類型:接頭，公引腳 連接器類型:Impact? 位置數(shù):96 加載位置的數(shù)目:全部 間距:0.053"（1.35mm） 行數(shù):12 列數(shù):8 安裝類型:通孔 端子:壓配式 觸點(diǎn)布局，典型:32 差分對(duì) 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:30µin（0.76µm） 顏色:黑 包裝:托盤 額定電流:- 材料可燃性額定值:UL94 V-0 工作溫度:-55°C ~ 85°C 額定電壓:30V 其它名稱:76155-1835761551835 |
| 0736590004 | 功能描述:2MM HDM BP PW ST3.5 30AU GF 3CKT RoHS:是 類別:連接器，互連式 >> 背板 - 專用 系列:HDM® （高密度） 73659 標(biāo)準(zhǔn)包裝:260 系列:Impact™ 76155 連接器用途:中平面 連接器類型:接頭，公引腳 連接器類型:Impact? 位置數(shù):96 加載位置的數(shù)目:全部 間距:0.053"（1.35mm） 行數(shù):12 列數(shù):8 安裝類型:通孔 端子:壓配式 觸點(diǎn)布局，典型:32 差分對(duì) 特點(diǎn):- 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:30µin（0.76µm） 顏色:黑 包裝:托盤 額定電流:- 材料可燃性額定值:UL94 V-0 工作溫度:-55°C ~ 85°C 額定電壓:30V 其它名稱:76155-1835761551835 |
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| 0736610000 | 制造商:Molex 功能描述:2MM HDM/VHDM/HSD DC ACCEPTOR-KEY SSTEEL - Rail/Tube |
| 0736700006 | 制造商:Molex 功能描述:HDM DAUGHTERCARD ASSEMBLY - Rail/Tube |
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