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參數(shù)資料
| 型號(hào)： | 0229.500P |
| 元件分類： | 保險(xiǎn)絲 |
| 英文描述： | TIME LAG BLOW ELECTRIC FUSE, 0.5A, 250VAC, 125VDC, 35A (IR), INLINE/HOLDER |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 215K |
| 代理商： | 0229.500P |
Revised: February 25, 2009
Introduction to Circuit Protection
Transientology
262
2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Axial Lead & Cartridge Fuses
2AG > Time Lag > 229/230 Series
229/230 Series
Please refer to www.littelfuse.com/series/229.html
or /230.html for current information.
Average Time Current Curves
Temperature Rerating Curve
1000
100
10
1
0.1
0.01
0.1
1
10
100
1000
.250A
.375A .500A
.750A 1.00A
1.50A 2.0A 2.5A 3.0A 3.5A 4A 5A 7A
TIME
IN
SECONDS
CURRENT IN AMPERES
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
5
0
60
70
80
90
100
110
120
130
140
1
5
0
160
170
180
190
200
210
220
230
240
Time (Seconds)
T
emperature
(°C)
-
Measured
on
bottom
side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time:
60-180 seconds
Solder PotTemperature:
260
° C Maximum
Solder DwellTime:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
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