參數(shù)資料
型號(hào)： μPD75P3036
廠商： NEC Corp.
英文描述： 4 Bit Single Chip Microcontrollers(4 位單片微控制器)
中文描述： 4位單片微控制器（4位單片微控制器）
文件頁(yè)數(shù)： 54/64頁(yè)
文件大?。?/td> 382K
代理商： ΜPD75P3036
54
m
PD75P3036
15. RECOMMENDED SOLDERING CONDITIONS
Solder the
m
PD75P3036 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 15-1. Soldering Conditions of Surface Mount Type
(1)
m
PD75P3036GC-3B9: 80-pin plastic QFP (14
￥
14 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235 °C, Reflow time: 30 seconds or below
(210 °C or higher), Number of reflow processes: 3 max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Reflow time: 40 seconds or below
(200 °C or higher), Number of reflow processes: 3 max.
VP15-00-3
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or below,
Number of flow processes: 1
Preheating temperature: 120 °C or below (package surface temperature)
WS60-00-1
Pin partial heating
Pin temperature: 300 °C or below, Time: 3 seconds or below (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the pin partial heating method).
(2)
m
PD75P3036GK-BE9: 80-pin plastic TQFP (fine pitch) (12
￥
12 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-107-3
VPS
VP15-107-3
Wave soldering
WS60-107-1
Pin partial heating
—
Note
The number of days for storage after the dry pack has been opened. The storage conditions are 25 °C, 65 % RH max.
Caution
Do not use two or more soldering methods in combination (except the pin partial heating method).
Package peak temperature: 235 °C, Reflow time: 30 seconds or below (210
°C or higher), Number of reflow processes: 3 max., Exposure limit: 7 days
Note
(After that, prebaking is necessary at 125 °C for 10 hours.)
Package peak temperature: 215 °C, Reflow time: 40 seconds or below (200
°C or higher), Number of reflow processes: 3 max., Exposure limit: 7 days
Note
(After that, prebaking is necessary at 125 °C for 10 hours.)
Solder temperature: 260 °C or below, Flow time: 10 seconds or below,
Number of flow processes: 1,
Preheating temperature: 120 °C or below (package surface temperature)
Exposure limit: 7 days
Note
(After that, prebaking is necessary at 125 °C for 10
hours.)
Pin temperature: 300 °C or below, Time: 3 seconds or below (per side of device)
*
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