參數(shù)資料
型號(hào): UPD784038YGK
廠商: NEC Corp.
英文描述: RECTIFIER BRIDGE 1.5A 1000V 40A-ifsm 1.1V-vf 5uA-ir KBP 35/TUBE
中文描述: 16-/8-bit的單晶片微控制器
文件頁(yè)數(shù): 87/94頁(yè)
文件大小: 503K
代理商: UPD784038YGK
87
μ
PD784035Y, 784036Y, 784037Y, 784038Y
Table 15-1. Soldering Conditions for Surface Mount Type (2/2)
(3)
μ
PD784037YGK-
×××
-BE9: 80-pin plastic TQFP (fine-pitch) (12
×
12 mm)
μ
PD784038YGK-
×××
-BE9: 80-pin plastic TQFP (fine-pitch) (12
×
12 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less (210
°
C or more)
Number of reflow processes: 2 or less
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C afterward)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (200
°
C or more)
Number of reflow processes: 2 or less
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
°
C afterward)
Pin temperature: 300
°
C or less, Flow time: 3 seconds or less
(per side of a device)
IR35-107-2
VPS
VP15-107-2
Partial heating
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65% or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method).
相關(guān)PDF資料
PDF描述
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