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參數資料
| 型號： | UPD753016GK-XXX-BE9 |
| 廠商： | NEC Corp. |
| 英文描述： | MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|TQFP|80PIN|PLASTIC |
| 中文描述： | 單片機| 4位| UPD75XL的CPU |的CMOS | TQFP封裝| 80腳|塑料 |
| 文件頁數： | 3/80頁 |
| 文件大?。?/td> | 569K |
| 代理商： | UPD753016GK-XXX-BE9 |
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3
μ
PD753012, 753016, 753017
CONTENTS
1.
PIN CONFIGURATION (TOP VIEW) ...................................................................................................5
2.
BLOCK DIAGRAM...............................................................................................................................7
3.
PIN FUNCTION ....................................................................................................................................8
3.1
Port Pins ......................................................................................................................................8
3.2
Pins Other than Port Pins ........................................................................................................10
3.3
Pin Input/Output Circuits .........................................................................................................12
3.4
Recommended Connection for Unused Pins.........................................................................14
4.
SWITCHING FUNCTION BETWEEN MK I MODE AND MK II MODE ......................................15
4.1
Differences between Mk I Mode and Mk II Mode....................................................................15
4.2
Setting Method of Stack Bank Select Register (SBS) ...........................................................16
5.
MEMORY CONFIGURATION ............................................................................................................17
6.
PERIPHERAL HARDWARE FUNCTIONS .......................................................................................21
6.1
Digital Input/Output Ports ........................................................................................................21
6.2
Clock Generator ........................................................................................................................22
6.3
Subsystem Clock Oscillator Control Functions ....................................................................23
6.4
Clock Output Circuit .................................................................................................................24
6.5
Basic Interval Timer/Watchdog Timer.....................................................................................25
6.6
Watch Timer ..............................................................................................................................26
6.7
Timer/Event Counter.................................................................................................................27
6.8
Serial Interface ..........................................................................................................................31
6.9
LCD Controller/Driver ...............................................................................................................33
6.10 Bit Sequential Buffer … 16 Bits ...............................................................................................35
7.
INTERRUPT FUNCTION AND TEST FUNCTION...........................................................................36
8.
STANDBY FUNCTION.......................................................................................................................38
9.
RESET FUNCTION ............................................................................................................................39
10. MASK OPTION ..................................................................................................................................42
11. INSTRUCTION SETS AND THEIR OPERATIONS ........................................................................43
12. ELECTRICAL SPECIFICATIONS......................................................................................................55
13. PACKAGE DRAWINGS.....................................................................................................................68
14. RECOMMENDED SOLDERING CONDITIONS................................................................................70
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