參數(shù)資料
型號： TDA8924TH/N2,518
廠商： NXP SEMICONDUCTORS
元件分類： 音頻／視頻放大
英文描述： 120 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24
封裝： PLASTIC, SOT-566-3, HSOP-24
文件頁數(shù)： 27/35頁
文件大?。?/td> 722K
代理商： TDA8924TH/N2,518
2003 Jul 28
33
Philips Semiconductors
Objective specication
2
× 120 W class-D power amplier
TDA8924
18.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(7)
suitable
相關PDF資料
PDF描述
TDA8926TH 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24
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TDA8932TW 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32
TDA8933BTW/N2,512 20.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
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相關代理商/技術參數(shù)
參數(shù)描述
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