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參數(shù)資料
| 型號： | TDA8920TH/N1,118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 80 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| 封裝： | PLASTIC, SOT-566-3, HSOP-24 |
| 文件頁數(shù)： | 27/36頁 |
| 文件大?。?/td> | 733K |
| 代理商： | TDA8920TH/N1,118 |
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2002 Sep 25
33
Philips Semiconductors
Product specication
2
× 80 W class-D power amplier
TDA8920
18.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TDA8924TH/N2,518 | 120 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8926TH | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8929T/N1,118 | 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8932TW | 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| TDA8933BTW/N2,512 | 20.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8922 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 x 25 W class-D power amplifier |
| TDA8922B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
| TDA8922BJ | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
| TDA8922BJ/N2,112 | 功能描述:音頻放大器 2X50W CLASSD PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TDA8922BTH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
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