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參數(shù)資料
| 型號： | TDA8775G |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | DAC |
| 英文描述： | PARALLEL, WORD INPUT LOADING, 0.003 us SETTLING TIME, 10-BIT DAC, PQFP48 |
| 封裝： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-313-2, LQFP-48 |
| 文件頁數(shù)： | 7/20頁 |
| 文件大小： | 95K |
| 代理商： | TDA8775G |
2002 Apr 24
15
Philips Semiconductors
Product specication
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8775G/C1,151 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC TRIPLE 10-BIT VIDEO DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TDA8775GB-S | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Video DAC without Color Palette |
| TDA8775GB-T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Video DAC without Color Palette |
| TDA8776 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:10-bit, 500 Msps Digital-to-Analog Converter DAC |
| TDA8776A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:10-bit, 1000 Msps Digital-to-Analog Converter DAC |
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