參數(shù)資料
型號: S71GL064A40BFW0F3
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產品(MCP)的閃存和RAM
文件頁數(shù): 52/102頁
文件大小: 1606K
代理商: S71GL064A40BFW0F3
52
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
A d v a n c e I n f o r m a t i o n
Any commands written during the chip erase operation are ignored. However,
note that a
hardw are reset
immediately terminates the erase operation. If that
occurs, the chip erase command sequence should be reinitiated once the device
has returned to reading array data, to ensure data integrity.
Figure 6
illustrates the algorithm for the erase operation. Refer to the Erase and
Program Operations table in the AC Characteristics section for parameters, and
Figure 18
section for timing diagrams.
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S71GL064A80BAW0F0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFW0F0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A40BFW0F0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0F0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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