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8
REG1117
The SOT-223 package derives heat sinking from conduction
through its copper leads, especially the large mounting tab.
These must be soldered to a circuit board with a substantial
amount of copper remaining (see Figure 5). Circuit board
traces connecting the tab and the leads should be made as
large as practical. The mounting tab of both packages is
electrically connected to VOUT.
Without back-side copper:
θ
JA ≈ 59°C/W
With solid back-side copper:
θ
JA ≈ 49°C/W
FIGURE 5. SOT-223 Circuit Board Layout Example.
Total Area: 50 x 50mm
35 x 17 mm
16 x 10 mm
Other nearby circuit traces, including those on the back side
of the circuit board, help conduct heat away from the device,
even though they may not be electrically connected. Make
all nearby copper traces as wide as possible and leave only
narrow gaps between traces.
Table I shows approximate values of
θ
JA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting condi-
tions and ventilation can dramatically affect the actual
θ
JA.
Proper heat sinking significantly increases the maximum
power dissipation at a given ambient temperature as shown
in Figure 6.
SOLDERING METHODS
Both REG1117 packages are suitable for infrared reflow and
vapor-phase reflow soldering techniques. The high rate of
temperature change that occurs with wave soldering, or hand
soldering can damage the REG1117.
TOPSIDE(1)
BACKSIDE
SOT-223
TOTAL PC BOARD
COPPER
THERMAL RESISTANCE
AREA
JUNCTION-TO-AMBIENT
2500mm2
46
°C/W
2500mm2
1250mm2
2500mm2
47
°C/W
2500mm2
950mm2
2500mm2
49
°C/W
2500mm2
051
°C/W
2500mm2
1800mm2
053
°C/W
1600mm2
600mm2
1600mm2
55
°C/W
2500mm2
1250mm2
058
°C/W
2500mm2
915mm2
059
°C/W
1600mm2
600mm2
067
°C/W
900mm2
340mm2
900mm2
72
°C/W
900mm2
340mm2
085
°C/W
NOTE: (1) Tab is attached to the topside copper.
TABLE I.
INSPEC Abstract Number: B91007604, C91012627
Kelly, E.G. “Thermal Characteristics of Surface 5WK9
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive Surface
Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA.
Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.
FIGURE 6. Maximum Power Dissipation vs Ambient
Temperature.
FIGURE 7. SCSI Active Termination Configuration.
10F
REG1117-2.85
110
110
110
110
10F
1N5817
5V
TERMPWR
2.85V
TERMPWR
1N5817
5V
(Up to 27 Lines)
REG1117-2.85
6
5
4
3
2
1
0
Power
Dissipation
(Watts)
0
25
50
75
100
125
Ambient Temperature (°C)
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
P
D = (TJ (max) – TA) /
JA
T
J (max) = 150°C
θ
DDPAK
SOT-223
JA = 85°C/W
(340mm2 topside copper,
no backside copper)
θ
JA = 46°C/W
(2500mm2 topside and
backside copper)
θ
JA = 27°C/W
(4in2 one oz copper
mounting pad)
θ
JA = 65°C/W
(no heat sink)