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參數(shù)資料
| 型號： | PCM1723E |
| 英文描述： | Audio Digital-to-Analog Converter |
| 中文描述： | 音頻數(shù)字模擬轉(zhuǎn)換器 |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 223K |
| 代理商： | PCM1723E |
MPLAB
ICE
DS51140D-page 2
2001 Microchip Technology Inc.
2.4
Flex Circuit Cable
Once the Processor Module is inserted into the Emula-
tor Pod, the flex circuit cable extends the emulator sys-
tem to the target application. This is a custom cable that
is attached inside the Processor Module enclosure and
can be replaced in the field by removing the end cap of
the Processor Module enclosure.
Please, DO NOT PULL on the flex circuit cable to
remove the Processor Module from the pod. Use the
fins of the Processor Module end cap to leverage the
module from the pod.
2.5
Device Adapter
The Device Adapter provides a common interface for
the device being emulated. They are provided in stan-
dard DIP and PLCC styles. The adapter also contains
a special device that provides an oscillator clock to
accurately emulate the oscillator characteristics of the
PICmicro MCU.
2.6
Transition Socket
Transition Sockets are available in various styles to
allow a common Device Adapter to be connected to
one of the supported surface mount package styles.
Transition Sockets are available for various pin counts
and pitches for SOIC, QFP and other styles. For more
information on transition sockets, see the
MPLAB ICE
Transition Socket Specification
(DS51194).
An emulator system consists of the following compo-
nents which are ordered separately:
An Emulator Pod (including the host-to-pod cable
and power supply)
A Processor Module (including the flex circuit
cable)
A Device Adapter
An optional Transition Socket (for surface mount
emulation)
3.0
PROCESSOR MODULES
Processor Modules are identified on the top of the
assembly (e.g., PCM17XA0). To determine which pro-
cessors are supported by a specific module, refer to the
latest
Development
Systems
(DS30177) or
Product Line Card
(DS00148). Both can
be found on our Web site (www.microchip.com).
A typical Processor Module contains a special bond-
out version of a PICmicro MCU, device buffers to con-
trol data flow and control logic. It provides the means of
configuring the MPLAB ICE emulator for a specific PIC-
micro MCU family and handles low-voltage emulation
when needed.
Ordering
Guide
3.1
POWER
The operating voltage for most of the control logic and
buffering on the Processor Module is +5V and is
supplied by the Emulator Pod. Power to the emulator
processor and some of its surrounding buffers is user
selectable, and can be powered by the Emulator Pod
(at +5V only) or the target application system (from
2.0V to 5.5V). This is software selectable and is config-
urable through the MPLAB IDE software. At no time will
the emulator system directly power the target applica-
tion system. ALWAYS insert the Processor Module into
the Emulator Pod before applying power to the pod.
When connecting to a target application system, the
user may notice a voltage level on the target application
even though they have not yet applied power to the tar-
get application circuit. This is normal, and is due to cur-
rent leakage through V
CC
of the Device Adapter. The
current leakage will typically be less than 20 mA.
However, if the target application is using a voltage
regulator, it should be noted that some regulators
require the use of an external shunt diode between V
IN
and V
OUT
for reverse-bias protection. Refer to the
manufacturer
’
s data sheets for additional information.
3.1.1
EMULATOR PROCESSOR POWER
SUPPLIED BY EMULATOR SYSTEM
If the emulator system is selected to power the
emulator processor in the Processor Module, the emu-
lator system can be operated without being connected
to a target application. If the system is being connected
to a target application, the power to the pod should be
applied before applying power to the target application.
Note that the target application system
’
s V
CC
will expe-
rience a small current load (10 mA typical) when the
emulator system is connected via a Device Adapter.
This is because the target system must always power
the clock chip in the Processor Module.
3.1.2
EMULATOR PROCESSOR POWER
SUPPLIED BY TARGET APPLICATION
SYSTEM
When the MPLAB IDE software is brought up, the emu-
lator system is first initialized with the emulator system
powering the emulator processor. The
“
Processor
Power Supplied by Target Board
”
option may then be
selected using the Power tab of the Options>Develop-
ment Mode dialog to power the Processor Module from
the target board.
When operating from external power, the Processor
Module will typically represent a current load equivalent
to the device being emulated (according to its data
sheet) plus approximately 100 mA. Keep in mind that
the target application will affect the overall current load
of the Processor Module, dependent upon the load
placed upon the processor I/O.
Note:
When removing the Processor Module,
DO NOT pull on the flex cable. Use the
tabs on the Processor Module or damage
to the flex cable may occur.
相關(guān)PDF資料 |
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| PCM1723E/2K | 功能描述:音頻數(shù)/模轉(zhuǎn)換器 IC Ster DAC w/Prog PLL RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量: 分辨率:16 bit 接口類型:I2S, UBS 轉(zhuǎn)換速率: 信噪比:98 dB 工作電源電壓:5 V DAC 輸出端數(shù)量:2 工作溫度范圍:- 25 C to + 85 C 電源電流:23 mA 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-32 封裝:Reel |
| PCM1723E/2KG4 | 功能描述:音頻數(shù)/模轉(zhuǎn)換器 IC Ster DAC w/Prog PLL RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量: 分辨率:16 bit 接口類型:I2S, UBS 轉(zhuǎn)換速率: 信噪比:98 dB 工作電源電壓:5 V DAC 輸出端數(shù)量:2 工作溫度范圍:- 25 C to + 85 C 電源電流:23 mA 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-32 封裝:Reel |
| PCM1723EG | 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述: |
| PCM1723EG/2K | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL-TO-ANALOG CONVERTER With Programmable PLL |
| PCM1723EG4 | 功能描述:音頻數(shù)/模轉(zhuǎn)換器 IC Ster DAC w/Prog PLL RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量: 分辨率:16 bit 接口類型:I2S, UBS 轉(zhuǎn)換速率: 信噪比:98 dB 工作電源電壓:5 V DAC 輸出端數(shù)量:2 工作溫度范圍:- 25 C to + 85 C 電源電流:23 mA 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-32 封裝:Reel |
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