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參數(shù)資料
| 型號： | PCF85162T/1 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 顯示驅動器 |
| 英文描述： | LIQUID CRYSTAL DISPLAY DRIVER, PDSO48 |
| 封裝： | 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48 |
| 文件頁數(shù)： | 31/43頁 |
| 文件大?。?/td> | 321K |
| 代理商： | PCF85162T/1 |
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PCF85162_2
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 7 May 2010
37 of 43
NXP Semiconductors
PCF85162
Universal LCD driver for low multiplex rates
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20 and 21
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
Table 20.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 21.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| PCF85163T/1,518 | 制造商:NXP Semiconductors 功能描述:PCF85163T/SO8/REEL13DP//1 - Tape and Reel 制造商:NXP Semiconductors 功能描述:PHAPCF85163T/1,518 RTC |
| PCF85163T/1518 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCF85163TS/1,118 | 制造商:NXP Semiconductors 功能描述:PCF85163TS/TSSOP8/REEL13//1 - Tape and Reel 制造商:NXP 功能描述:0 |
| PCF85176 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCF85176H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
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