參數(shù)資料
型號: NCV8675DS50R4G
廠商: ON SEMICONDUCTOR
元件分類: 基準電壓源/電流源
英文描述: 350 mA Very Low Iq Low Dropout Linear Regulator with Reset and Reset Delay
中文描述: 5 V FIXED POSITIVE LDO REGULATOR, 0.6 V DROPOUT, PSSO5
封裝: LEAD FREE, D2PAK-5
文件頁數(shù): 12/15頁
文件大小: 173K
代理商: NCV8675DS50R4G
NCV8675
http://onsemi.com
12
Calculating Power Dissipation
in a Single Output Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 36) is:
PD(max)
[VI(max)
VOUT(min)]IOUT(max)
(1)
VI(max)Iq
where
V
I(max)
V
OUT(min)
is the minimum output voltage,
I
OUT(max)
is the maximum output current for the
application,
I
q
is the quiescent current the regulator
consumes at I
Q(max)
.
Once the value of P
D(max)
is known, the maximum
permissible value of R
JA
can be calculated:
is the maximum input voltage,
RJA
150
°
C
TA
PD
(2)
The value of R
JA
can then be compared with those in the
package section of the data sheet. Those packages with
R
JA
's less than the calculated value in Equation 34 will
keep the die temperature below 150
°
C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
I
I
V
I
SMART
REGULATOR
Iq
Control
Features
I
OUT
Figure 36. Single Output Regulator with Key
Performance Parameters Labeled
V
OUT
}
Heatsinks
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
JA
:
RJA
RJC
RCS
RSA
(3)
where
R
JC
is the junction-to-case thermal resistance,
R
CS
is the case-to-heatsink thermal resistance,
R
SA
is the heatsink-to-ambient thermal resistance.
R
JC
appears in the package section of the data sheet. Like
R
JA
, it too is a function of package type. R
CS
and R
SA
are
functions of the package type, heatsink and the interface
between them. These values appear in heatsink data sheets
of heatsink manufacturers.
Thermal, mounting, and heatsinking considerations are
discussed in the ON Semiconductor application note
AN1040/D.
COPPER AREA (mm
2
)
Figure 37.
T
(
°
C
°
C
PULSE TIME (sec)
Figure 38. NCV8675 @ PCB Cu Area 100 mm
2
PCB Cu thk 1 oz
0
25
50
75
100
0
100
200
300
400
500
600
700
800
900
D
2
PAK 1 oz
D
2
PAK 2 oz
0.1
1
10
100
0.000001
0.0001
0.01
1
100
D
2
PAK
Single Pulse
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