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參數(shù)資料
| 型號(hào)： | NAND512R3A2CZA1T |
| 元件分類(lèi)： | 開(kāi)關(guān) |
| 英文描述： | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| 文件頁(yè)數(shù)： | 7/7頁(yè) |
| 文件大?。?/td> | 525K |
| 代理商： | NAND512R3A2CZA1T |
A-84
APEM
www.apem.com
12000X778 series
High performance toggle switches - threaded bushing 11,9 (15/32)
A
FLUORESCENT TIP
X778
Blank
None
0.38
White fluorescent tip.
Becomes luminous when submitted to ultra-violet rays.
Standard lever
Locking lever
LEVERS
/ LOCKING LEVERS
Locking levers
Levers
Standard (leave blank)
-12
Short lever
Dash compulsory before lever code.
Sealing boots : see section H.
Security caps : see section I.
-1V
1 locked position (function 6)
Typical angle of throw : 26°
Consult factory for other locking lever options.
-2V
2 locked positions (function 6)
Typical angle of throw : 26°
-3V
3 locked positions (functions 9 and 4)
Typical angle of throw : 20°
Flat
AGENCY APPROVAL
C
CEEC
CC
C
CECC 96201-005 and CECC 96201-008
Availability
: consult factory for details of approved models.
Marking
: to order switches marked CECC, please complete above box with "CECC".
Blank : no agency approval required.
X778
(.
4
6
4
)
(.196 DIA)
5.00
1
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0
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4
6
8
)
1
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0
(.
4
6
8
)
(.
7
6
3
)
1
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0
1
9
.4
0
(.275 D
IA)
7.00
(.275 D
IA)
1
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0
(.
4
6
8
)
1
9
.4
0
(.
7
6
3
)
(.
4
6
8
)
1
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0
(.
8
1
)
2
0
.6
0
(.275)
7.00
1
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0
(.
4
6
8
)
(.
6
8
1
)
(.236 DIA)
1
7
.3
0
6.00
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| NAND512R3A2CZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SRAM - 同步，DDR II 存儲(chǔ)容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤(pán) 其它名稱(chēng):71P71804S200BQ |
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| NAND512R3A2DZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線(xiàn)串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
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