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參數(shù)資料
| 型號： | NAND02GR3B |
| 元件分類： | 開關 |
| 英文描述： | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 525K |
| 代理商： | NAND02GR3B |
APEM
www.apem.com
A-83
12000X778 series
High performance toggle switches - threaded bushing 11,9 (15/32)
Positions and connections
A
FUNCTION
12146
12147
12148
12149
12148CT
12145
12144
12144-1R
12144-2R
12156
12166
12164
TERMINAL
IDENTIFICATION
WIRING FOR 3-WAY SWITCHES
(FUNCTION 4)
LEVER POSITION AND CONNECTIONS
I
II
III (Flat)
ON
-
ON
(1-3)-4
(1-3)-2
(5-7)-8
(5-7)-6
MOM
OFF
MOM
ON
OFF
MOM
ON
OFF
ON
MOM
OFF
ON
1-2
1-3
4-5
4-6
-
ON
MOM
1-2
1-3
4-5
4-6
ON
MOM
ON
MOM
ON
MOM
1-2
1-3
4-5
4-6
ON
-
ON
(1-3)-4
(1-3)-2
(5-7)-8
(5-7)-6
(9-11)-12
(9-11)-10
ON
-
ON
1A - 3A
1A - 2A
1C - 3C
1C - 2C
1E - 3E
1E - 2E
1G - 3G
1G - 2G
ON
1A - 2A
1A - 3A
1C - 2C
1C - 3C
1E - 2E
1E - 3E
1G - 2G
1G - 3G
External jumper (added by customer)
12164
12144
12144-1R
12144-2R
Flat
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
CE
G
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
CE
G
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
CE
G
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
A
2
1
33
1
2
4
3-1
210
9-11
12
3
1
25
4
6
7-5
8
4
3-1
2
CE
G
A
2
1
33
1
2
4
3-1
210
9-11
12
1
25
4
6
7-5
8
4
3-1
2
1
4
3
2
6
5
4
1
3
2
6
5
4
1
3
2
6
5
1A
2A
1C
1E
1G
3A
2C
3C
2E
3E
2G
3G
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| NAND02GR3B2CWFD | 制造商:Micron Technology Inc 功能描述:NRND 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND02GR3B2CZA6F | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 1.8V 2GBIT 256M X 8 25US 63VFBGA - Tape and Reel |
| NAND02GR3B2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND02GR3B2DN6E | 功能描述:IC FLASH 2GBIT 48TSOP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
| NAND02GR3B2DWFD | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
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