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參數(shù)資料
| 型號(hào)： | MPXS4100A6U |
| 廠商： | MOTOROLA INC |
| 元件分類(lèi)： | 壓力傳感器 |
| 英文描述： | INTEGRATED PRESSURE SENSOR |
| 中文描述： | ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-15.22Psi, 1.8%, 0.30-4.95V, RECTANGULAR, SURFACE MOUNT |
| 封裝： | 471-01 |
| 文件頁(yè)數(shù)： | 5/6頁(yè) |
| 文件大?。?/td> | 94K |
| 代理商： | MPXS4100A6U |
5
Motorola Sensor Device Data
INFORMATION FOR USING THE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self align when subjected to
a solder reflow process.
0.835
0.060 TYP 8X
0.080 TYP 8X
0.100 TYP
0.300
NOT TO SCALE
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of this device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device damage and/or failure.
Therefore, the following items should always be observed in
order to minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
zones should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case, including the port, must not exceed
the maximum temperature ratings as shown on the data
sheet. When using infrared heating with the reflow
soldering method, the difference between the leads and
the case shall be a maximum of 10
°
C.
Wave soldering is not recommended for the pressure
sensor surface mount package due to the exposure of
the die to the environment.
The soldering temperature and time shall not exceed
240
°
C for more than 5 seconds.
When shifting from preheating to soldering zones, the
maximum temperature gradient or rise rate shall be
2
°
C/second or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
Recommend usage of a no–clean solder paste to avoid
circuit board cleaning.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
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| MPXS4115AC6U | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXS4115A | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR |
| MPXS4115AC6U | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR |
| MPXT2010 | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:COMPENSATED PRESSURE SENSOR |
| MPXT2010G7U | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:COMPENSATED PRESSURE SENSOR |
| MPXT4100 | 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:X-ducer SILICON PRESSURE SENSORS |
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