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參數(shù)資料
| 型號： | MPX2201 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| 中文描述： | 0至200千帕（0至29 PSI）的全尺寸為40 mV跨度（典型） |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 171K |
| 代理商： | MPX2201 |
3
Motorola Sensor Device Data
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Figure 2. Linearity Specification Comparison
LEAST
SQUARE
DEVIATION
R
PRESSURE (% FULLSCALE)
0
50
100
END POINT
STRAIGHT LINE FIT
EXAGGERATED
PERFORMANCE
CURVE
LEAST SQUARES FIT
STRAIGHT LINE
DEVIATION
OFFSET
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2200
series at 25
°
C. The output is directly proportional to the dif-
ferential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
Figure 3. Output versus Pressure Differential
Figure 4. Cross–Sectional Diagrams (Not to Scale)
40
35
30
25
20
15
10
5
0
–50
PSI
50
7.25
100
14.5
150
21.75
200
29
PRESSURE
O
SPAN
RANGE
(TYP)
OFFSET
kPa
VS = 10 Vdc
TA = 25
°
C
P1 > P2
25
75
125
175
MAX
TYP
MIN
éééééééééééé
éééééééééééé
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
SILICONE GEL
DIE COAT
WIRE BOND
DIFFERENTIAL/GAUGE
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ABSOLUTE ELEMENT
P2
P2
P1
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case
344–15). A silicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure sig-
nal to be transmitted to the silicon diaphragm.
The MPX2200 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPX2200A | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2200AP | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2200D | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2200DP | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2200GP | 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPX2201DP | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2201GP | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) |
| MPX2202 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors |
| MPX2202_08 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors |
| MPX2202_12 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors |
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