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| 型號： | MPC8567ECVTAQGGA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA1023 |
| 封裝： | 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1023 |
| 文件頁數(shù)： | 26/139頁 |
| 文件大?。?/td> | 1449K |
| 代理商： | MPC8567ECVTAQGGA |
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MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
121
Clocking
23 Clocking
This section describes the PLL configuration of the MPC8568E. Note that the platform clock is identical
to the core complex bus (CCB) clock.
23.1
Clock Ranges
Table 80 provides the clocking specifications for the processor cores and Table 81 provides the clocking
specifications for the DDR/DDR2 memory bus. Table 82 provides the clocking specifications for the local
bus.
30. This pin requires an external 4.7-k
Ω pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is actively
driven.
33. PF[21:22] are multiplexed as cfg_dram_type[0:1]. THEY MUST BE VALID AT POWER-UP, EVEN BEFORE HRESET
ASSERTION.
35. When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled down
to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the PCIn_AD pins as "No Connect"
or terminated through 2–10 K
Ω pull-up resistors with the default of internal arbiter if the PCIn_AD pins are not connected to any
other PCI device. The PCI block will drive the PCIn_AD pins if it is configured to be the PCI arbiter—through POR config
pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is any other PCI
device connected on the bus.
36.MDIC[0] is grounded through an 18.2-
Ω precision 1% resistor and MDIC[1] is connected to GVDD through an 18.2-Ω precision
1% resistor. These pins are used for automatic calibration of the DDR IOs.
39. If PCI is configured as PCI asynchronous mode, a valid clock must be provided on pin PCI_CLK . Otherwise the processor
will not boot up.
41.These pins should be tied to SCOREGND through a 300 ohm resistor if the high speed interface is used.
43. It is highly recommended that unused SD_RX/SD_RX lanes should be powered down with lane_x_pd. Otherwise the receivers
will burn extra power and the internal circuitry may develop long term reliability problems.
46. Must be high during HRESET. It is recommended to leave the pin open during HRESET since it has internal pullup resistor.
47. Must be pulled down with 4.7-k
Ω resistor.
48. This pin must be left no connect.
49. A pull-up on LGPL4 is required for systems that boot from local bus (GPCM)-controlled NOR Flash.
Table 80. Processor Core Clocking Specifications
Characteristic
Maximum Processor Core Frequency
Unit
Notes
800 MHz
1000 MHz
1333 MHz
Min
Max
Min
Max
Min
Max
e500 core processor frequency
533
800
533
1000
533
1333
MHz
1, 2
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 23.2, “CCB/SYSCLK PLL Ratio,” and Section 23.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz.
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
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