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MK2751-01
MPEG/Set-Top Clock Source
MDS2751-01A
3
Revision 9227
Printed 1/2/98
MicroClock Division of ICS1271 Parkmoor Ave.San JoseCA95126(408)295-9800tel(408)295-9818fax
PRELIMINARY INFORMATION
ICRO
CLOCK
Parameter
Conditions
Minimum
Typical
Maximum
Units
ABSOLUTE MAXIMUM RATINGS (note 1)
Supply voltage, VDD
Referenced to GND
7
V
Inputs and Clock Outputs
Referenced to GND
-0.5
VDD+0.5
V
Ambient Operating Temperature
0
70
°C
Soldering Temperature
Max of 20 seconds
260
°C
Storage temperature
-65
150
°C
DC CHARACTERISTICS (VDD = 5.0V unless noted)
Operating Voltage, VDD
4.5
5.5
V
Input High Voltage, VIH, X1/ICLK pin only
3.5
2.5
V
Input Low Voltage, VIL, X1/ICLK pin only
2.5
1.5
V
Input High Voltage, VIH
2
V
Input Low Voltage, VIL
0.8
V
Output High Voltage, VOH
IOH=-25mA
2.4
V
Output Low Voltage, VOL
IOL=25mA
0.4
V
Output High Voltage, VOH, CMOS level
IOH=-8mA
VDD-0.4
V
Operating Supply Current, IDD
No Load, note 2
45
mA
Short Circuit Current
Each output
±100
mA
Input Capacitance
7
pF
Frequency error, ACLK
0
ppm
Frequency error, 24.576 MHz clock
40
ppm
AC CHARACTERISTICS (VDD = 5.0V unless noted)
Input Frequency
27.000
MHz
Output Clock Rise Time
0.8 to 2.0V
1.5
ns
Output Clock Fall Time
2.0 to 0.8V
1.5
ns
Output Clock Duty Cycle
At 1.4V
40
60
%
Absolute Jitter, short term
200
ps
Skew of PCLK and PCLK/2
Rising edges at 1.4V
-500
0
500
ps
Electrical Specifications
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged
exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.
2. With NUCLK at 40MHz, PCLK at 66.0MHz, and ACLK at 16.93MHz.
External Components
The MK2751-01 requires a minimum number of external components for proper operation. Decoupling
capacitors of 0.1F should be connected between VDD and GND (pins 4 and 5, and 13 and 11), as close
to the MK2751 as possible. A series termination resistor of 33
may be used for each clock output. If a
clock input is not used, the 27.00 MHz crystal must be fundamental mode, parallel resonant, and
connected as close to the chip as possible. Crystal capacitors should be connected from pins X1 to ground
and X2 to ground. The value (in pF) of these crystal capacitors should be = (CL-4)*2, where CL is the
crystal load capacitance in pF. So for a crystal with 16pF load capacitance, the crystal capacitors should be
24pF each.