參數(shù)資料
型號(hào): MCP631-E/SN
元件分類: 運(yùn)算放大器
英文描述: OP-AMP, 8000 uV OFFSET-MAX, 24 MHz BAND WIDTH, PDSO8
封裝: 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
文件頁數(shù): 11/42頁
文件大?。?/td> 790K
代理商: MCP631-E/SN
2009 Microchip Technology Inc.
DS22197A-page 19
MCP631/2/3/5
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN–, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select Digital Input (CS)
This input (CS) is a CMOS, Schmitt-triggered input that
places the part into a low power mode of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the Exposed
Thermal Pad (EP) and the VSS pin; they must be
connected to the same potential on the Printed Circuit
Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
θJA).
MCP631
MCP632
MCP633
MCP635
Symbol
Description
SOIC
DFN
SOIC
MSOP
DFN
61
1
6
1
VOUT, VOUTA
Output (op amp A)
22
2
VIN–, VINA
Inverting Input (op amp A)
33
3
VIN+, VINA+
Non-inverting Input (op amp A)
44
4
VSS
Negative Power Supply
——
8
5
CS, CSA
Chip Select Digital Input (op amp A)
——
6
CSB
Chip Select Digital Input (op amp B)
—5
5
7
VINB+
Non-inverting Input (op amp B)
—6
6
8
VINB
Inverting Input (op amp B)
—7
7
9
VOUTB
Output (op amp B)
7
8
7
10
VDD
Positive Power Supply
1,5,8
1,5
NC
No Internal Connection
9
11
EP
Exposed Thermal Pad (EP);
must be connected to VSS
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