參數(shù)資料
型號(hào): MCF51QE128
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: 32-Bit Version 1 ColdFire㈢ Central Processor Unit (CPU)
中文描述: 32位版本1的ColdFire㈢中央處理器(CPU)的
文件頁數(shù): 10/38頁
文件大?。?/td> 429K
代理商: MCF51QE128
MCF51QE128 Series Advance Information Data Sheet, Rev. 3
Electrical Characteristics
Freescale Semiconductor
10
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
I/O
into account in power calculations, determine
the difference between actual pin voltage and V
SS
or V
DD
and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and V
SS
or V
DD
will be very small.
Table 5. Thermal Characteristics
The average chip-junction temperature (T
J
) in
°
C can be obtained from:
T
J
= T
A
+ (P
D
×
θ
JA
)
Eqn. 1
Table 4. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
V
DD
I
DD
V
In
I
D
–0.3 to +3.8
V
Maximum current into V
DD
Digital input voltage
120
mA
–0.3 to V
DD
+ 0.3
±
25
V
Instantaneous maximum current
Single pin limit (applies to all port pins)
1, 2, 3
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (V
DD
) and negative (V
SS
) clamp
voltages, then use the larger of the two resistance values.
2
All functional non-supply pins are internally clamped to V
SS
and V
DD
.
3
Power supply must maintain regulation within operating V
DD
range during instantaneous and
operating maximum current conditions. If positive injection current (V
In
> V
DD
) is greater than
I
DD
, the injection current may flow out of V
DD
and could result in external power supply going
out of regulation. Ensure external V
DD
load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
mA
Storage temperature range
T
stg
–55 to 150
°
C
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
T
A
T
L
to T
H
–40 to 85
°
C
Maximum junction temperature
T
JM
95
°
C
Thermal resistance
Single-layer board
64-pin LQFP
θ
JA
69
°
C/W
80-pin LQFP
60
Thermal resistance
Four-layer board
64-pin LQFP
θ
JA
50
°
C/W
80-pin LQFP
47
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