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參數(shù)資料
| 型號： | MCP3304-CI/P |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 14/48頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 13BIT 2.7V 4CH SPI 16-DIP |
| 標準包裝： | 30 |
| 位數(shù)： | 13 |
| 采樣率（每秒）： | 100k |
| 數(shù)據(jù)接口： | 串行，SPI? |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 16-DIP（0.300"，7.62mm） |
| 供應商設備封裝： | 16-PDIP |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 8 個單端，單極；4 個差分，單極 |
| 產(chǎn)品目錄頁面： | 672 (CN2011-ZH PDF) |
| 其它名稱： | MCP3304CI/P |
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2011 Microchip Technology Inc.
DS21697F-page 21
MCP3302/04
5.7
Utilizing the Digital and Analog
Ground Pins
The MCP3302/04 devices provide both digital and
analog ground connections to provide another means
of noise reduction. As shown in Figure 5-11, the analog
and digital circuitry are separated internal to the device.
This reduces noise from the digital portion of the device
being coupled into the analog portion of the device. The
two grounds are connected internally through the
substrate which has a resistance of 5 -10.
If no ground plane is utilized, then both grounds must
be connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be
connected to the analog ground plane, as shown in
Figure 5-11. Following these steps will reduce the
amount of digital noise from the rest of the board being
coupled into the A/D Converter.
FIGURE 5-11:
Separation of Analog and
Digital Ground Pins.MCP3302/04.
MCP3302/04
Analog Ground Plane
DGND
AGND
VDD
0.1 F
Substrate
5 - 10
Digital Side
-SPI Interface
-Shift Register
-Control Logic
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
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