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參數(shù)資料
| 型號(hào)： | MC145750 |
| 廠商： | Motorola, Inc. |
| 英文描述： | QPSK Encoder |
| 中文描述： | 調(diào)制編碼器 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 296K |
| 代理商： | MC145750 |
MC145750
MOTOROLA
11
PACKAGE DIMENSIONS
VFU SUFFIX
PLASTIC VQFP
CASE 932–02
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
0.170
1.350
0.170
0.500 BASIC
0.050
0.090
0.500
12 REF
0.090
0.250 BASIC
1
0.150
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
MAX
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.007
0.053
0.007
0.020 BASIC
0.002
0.004
0.020
12 REF
0.004
0.010 BASIC
1
0.006
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
MAX
INCHES
MILLIMETERS
1.600
0.270
1.450
0.230
0.063
0.011
0.057
0.009
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
ééé
ééé
ééé
ééé
A
A1
–T–
Z
0.200 (0.008) AB T–U
–U–
4X
Z
0.200 (0.008) AC T–U
4X
B
B1
1
12
13
24
25
36
37
48
–Z–
S1
S
V
V1
P
AE
AE
–T–, –U–, –Z–
DETAIL Y
DETAIL Y
BASE METAL
N
J
F
D
S
T–U
M
0.080 (0.003)
Z
S
AC
SECTION AE–AE
–AB–
–AC–
AD
G
0.080 (0.003) AC
M
TOP & BOTTOM
Q
W
K
X
E
C
H
0.250 (0.010)
GAUGE PLANE
R
9
DETAIL AD
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