參數(shù)資料
型號(hào): LX6431BIDMT
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類(lèi): 基準(zhǔn)電壓源/電流源
英文描述: 500Mbps, Quad LVDS Driver, TSSOP 16-pin
中文描述: 1-OUTPUT TWO TERM VOLTAGE REFERENCE, PDSO8
封裝: PLASTIC, SOIC-8
文件頁(yè)數(shù): 2/11頁(yè)
文件大小: 155K
代理商: LX6431BIDMT
P
RECISION
P
ROGRAMMABLE
R
EFERENCES
LX 6431/ LX 6431A/ LX 6431B
PRODUCT DATABOOK 1 9 9 6 / 1 9 9 7
Copyright 1999
Rev. 1.4 6/99
2
P
R O D U C T I O N
D
A T A
S
H E E T
A B S O LU TE M A X IM U M R A TIN G S
(Note 1)
Cathode to Anode Voltage (V
) ................................................................... -0.3V to 37V
Reference Input Current (I
) ....................................................................-50μA to 10μA
Continuous Cathode Current (I
K
) ......................................................... -100mA to 150mA
Operating Junction Temperature
Plastic (DM & LP Packages) ................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature ..................................................................................................... 300°C
PA CK A G E PIN OUTS
CATHODE
N.C.
ANODE
N.C.
1
8
2
7
3
6
4
5
REF
ANODE
ANODE
N.C.
DM PACKAGE
(Top View)
LP PACKAGE
(Top View)
1.
CATHODE
2.
ANODE
3.
REF
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
165°C/W
156°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
TH ER M A L D A TA
B LO CK D IA G R A M
Cathode (K)
Anode (A)
V
REF
Ref (R)
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