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參數(shù)資料
| 型號(hào)： | L634 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | THREE PHASE MOTOR DRIVER |
| 中文描述： | 三相電機(jī)驅(qū)動(dòng) |
| 文件頁(yè)數(shù)： | 3/10頁(yè) |
| 文件大?。?/td> | 467K |
| 代理商： | L634 |
THERMAL DATA
Symbol
Parameter
DIP16+2+2
PowerSO20
Unit
°
C/W
R
th j-pin
Thermal Resistance, Junction to Pin
12
–
R
th j-amb1
Thermal Resistance, Junction to Ambient
(see Thermal Characteristics)
40
–
°
C/W
R
th j-amb2
Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
50
–
°
C/W
R
th j-case
Thermal Resistance Junction-case
–
1.5
°
C/W
Figure 1:
Printed Heatsink
THERMAL CHARACTERISTICS
R
th j-pins
DIP16+2+2
. The thermal resistance is referred to
the thermal path from the dissipating region on
the top surface of the silicon chip, to the points
along the four central pins of the package, at a
distance of 1.5 mm away from the stand-offs.
R
th j-amb1
If a dissipating surface, thick at least 35
μ
m, and
with a surface similar or bigger than the one
shown, is created making use of the printed cir-
cuit.
Such heatsinking surface is considered on the
bottom side of an horizontal PCB (worst case).
R
th j-amb2
If the power dissipating pins (the four central
ones), as well as the others, have a minimum
thermal connection with the external world (very
thin strips only) so that the dissipation takes place
through still air and through the PCB itself.
It is the same situation of point above, without any
heatsinking surface created on purpose on the
board.
Additional data on the PowerDip and the
PowerSO20 package can be found in:
Application Note AN467:
Thermal Characteristics of the PowerDip
20,24 Packages Soldered on 1,2,3 oz.
Copper PCB
Application Note AN668:
A New High Power IC Surface Mount Package:
PowerSO20 Power IC Packaging from Insertion
to Surface Mounting.
L6234
3/10
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