參數(shù)資料
型號(hào): KM736V587
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 32Kx36-Bit Synchronous Burst SRAM(32Kx36位同步脈沖 靜態(tài) RAM)
中文描述: 32Kx36位同步突發(fā)靜態(tài)存儲(chǔ)器(32Kx36位同步脈沖靜態(tài)內(nèi)存)
文件頁數(shù): 6/15頁
文件大?。?/td> 343K
代理商: KM736V587
PRELIMINARY
KM736V587
32Kx36 Synchronous SRAM
- 6 -
Rev 1.0
May 1997
OPERATING CONDITIONS
(0
°
C
T
A
70
°
C)
Parameter
Symbol
Min
Typ.
Max
Unit
Supply Voltage
V
DD
3.13
3.3
3.47
V
V
DDQ
3.13
3.3
3.47
V
Ground
V
SS
0
0
0
V
CAPACITANCE*
(T
A
=25
°
C, f=1MHz)
*NOTE
: Sampled not 100% tested.
Parameter
Symbol
Test Condition
Min
Max
Unit
Input Capacitance
C
IN
V
IN
=0V
-
5
pF
Output Capacitance
C
OUT
V
OUT
=0V
-
8
pF
TEST CONDITIONS
(T
A
=0 to 70
°
C, V
DD
=3.3V
±
5%, unless otherwise specified)
Parameter
Value
Input Pulse Level
0 to 3V
Input Rise and Fall Time(Measured at 0.3V and 2.7V)
2ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Fig. 1
DC ELECTRICAL CHARACTERISTICS
(T
A
=0 to 70
°
C, V
DD
=3.3V
±
5%)
* V
IL
(Min)= -3.0V(Pulse Width
20ns)
** In Case of I/O Pins, the Max. V
IH
=V
DDQ
+ 0.5V
Parameter
Symbol
Test Conditions
Min
Max
Unit
Input Leakage Current(except ZZ)
I
IL
V
DD
=Max , V
IN
=V
SS
to V
DD
-2
+2
μ
A
μ
A
Output Leakage Current
I
OL
Output Disabled, V
OUT
= V
SSQ
to V
DDQ
-2
+2
Operating Current
I
CC
Device Selected, I
OUT
=0mA,
ZZ
V
IL
, All Inputs=V
IL
or V
IH
Cycle Time
t
CYC
min
-8
-
330
mA
-9
-
330
-10
-
300
Standby Current
I
SB
Device deselected, I
OUT
=0mA,
ZZ
V
IL
, f=Max,
All Inputs
0.2V or
V
DD
-0.2V
-8
-
80
mA
-9
-
80
-10
-
60
I
SB1
Device deselected, I
OUT
=0mA,
ZZ
0.2V, f=0,
All Inputs=fixed (V
DD
-0.2V or 0.2V)
-
10
mA
I
SB2
Device deselected, I
OUT
=0mA,
ZZ
V
DD
-0.2V, f=Max,
All Inputs
V
IL
or
V
IH
-
10
mA
Output Low Voltage
V
OL
I
OL
=8.0mA
-
0.4
V
Output High Voltage
V
OH
I
OH
=-4.0mA
2.4
-
V
Input Low Voltage
V
IL
-0.5*
0.8
V
Input High Voltage
V
IH
2.2
5.5**
V
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