參數(shù)資料
型號: K4B1G1646C-ZCF7
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 1Gb C-die DDR3 SDRAM Specification
中文描述: 1Gb的?芯片的DDR3 SDRAM規(guī)范
文件頁數(shù): 18/63頁
文件大?。?/td> 1255K
代理商: K4B1G1646C-ZCF7
Page 18 of 63
Rev. 1.0 June 2007
1Gb DDR3 SDRAM
K4B1G04(08/16)46C
[ Table 10 ] Differential DC and AC input levels
Note :
1. Refer to "Overshoot and Undershoot specifications" on page 23.
Symbol
Parameter
DDR3-800/1066/1333
Unit
Notes
Min
+ 200
-
Max
-
- 200
VIHdiff
VILdiff
Differential input logic high
Differential input logic low
mV
1
[ Table 11 ] Cross point voltage for differential input signals (CK, DQS)
Symbol
Parameter
DDR3-800/1066/1333/1600
Min
-150
Unit
Notes
Max
150
VIX
Differential input Cross point voltage relative to VDD/2
mV
To guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, each cross point voltage of differential input
signals (CK, CK and DQS, DQS) must meet the requirements in below table. The differential input cross point voltage VIX is measured from the actual
cross point of true and complement signal to the midlevel between of VDD and VSS.
VDD
CK, DQS
VDD/2
CK, DQS
VSS
V
IX
V
IX
V
IX
8.4 Differential Input Cross Point Voltage
Figure 4. Vix Definition
8.3 AC and DC logic input levels for Differential Signals
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