參數(shù)資料
型號(hào)： ISP1183
廠商： NXP Semiconductors N.V.
英文描述： Low-power Universal Serial Bus interface device with DMA
中文描述： 低功耗通用串行總線與DMA接口設(shè)備
文件頁(yè)數(shù)： 61/62頁(yè)
文件大?。?/td> 295K
代理商： ISP1183
9397 750 11804
Philips Semiconductors
ISP1183
Low-power USB interface device with DMA
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 — 24 February 2004
61 of 62
Contact information
For additional information, please visit
http://www.semiconductors.philips.com
.
For sales office addresses, send e-mail to:
sales.addresses@www.semiconductors.philips.com
.
Fax: +31 40 27 24825
24. Data sheet status
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[3]
25. Definitions
Short-form specification —
The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition —
Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information —
Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
26. Disclaimers
Life support —
These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes —
Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
27. Trademarks
ACPI —
is an open industry specification for PC power management,
co-developed by Intel Corp., Microsoft Corp. and Toshiba
GoodLink —
is a trademark of Koninklijke Philips Electronics N.V.
IBM —
is a registered trademark of Internal Machines Corp.
Intel —
is a registered trademark of Intel Corp.
OnNow —
is a trademark of Microsoft Corp.
SoftConnect —
is a trademark of Koninklijke Philips Electronics N.V.
Zip —
is a registered trademark of Iomega Corp.
Level
Data sheet status
[1]
Product status
[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
相關(guān)PDF資料
PDF描述
ISP1183BS Low-power Universal Serial Bus interface device with DMA
ISP1301 Universal Serial Bus On-The-Go transceiver
ISP1301BS Universal Serial Bus On-The-Go transceiver
ISP1362 Single-chip Universal Serial Bus On-The-Go controller
ISP1362BD Single-chip Universal Serial Bus On-The-Go controller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1183BS 功能描述:IC USB HOST CTRL LOW-SPD 32HVQFN RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 專(zhuān)用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤(pán)（4x4） 包裝:帶卷 (TR) 安裝類(lèi)型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱(chēng):296-25223-2
ISP1183BS,118 功能描述:USB 接口集成電路 FULL-SPD USB2 DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1183BS,151 功能描述:USB 接口集成電路 FULL-SPD USB2 DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1183BS,157 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1183BSFA 功能描述:IC USB HOST CTRL LOW-SPD 32HVQFN RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 專(zhuān)用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤(pán)（4x4） 包裝:帶卷 (TR) 安裝類(lèi)型:表面貼裝 產(chǎn)品目錄頁(yè)面:1015 (CN2011-ZH PDF) 其它名稱(chēng):296-25223-2
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*