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      參數(shù)資料
      型號: IC42S16101-5TI
      英文描述: 512K x 16 Bit x 2 Banks (16-MBIT) SDRAM
      中文描述: 為512k × 16位× 2銀行(16兆)內(nèi)存
      文件頁數(shù): 7/78頁
      文件大小: 786K
      代理商: IC42S16101-5TI
      IC42S16101
      Integrated Circuit Solution Inc.
      DR025-0F 01/17/2005
      7
      Notes:
      1.
      When power is first applied, memory operation should be started 100 μs after Vcc and VccQ reach their stipulated
      voltages. Also note that the power-on sequence must be executed before starting memory operation.
      Measured with t
      T
      = 1 ns.
      The reference level is 1.4 V when measuring input signal timing. Rise and fall times are measured between V
      IH
      (min.) and
      V
      IL
      (max.).
      Access time is measured at 1.4V with the load shown in the figure below.
      The time t
      HZ
      (max.) is defined as the time required for the output voltage to transition by ± 200 mV from V
      OH
      (min.) or V
      OL
      (max.) when the output is in the high impedance state.
      2.
      3.
      4.
      5.
      AC CHARACTERISTICS
      (1,2,3)
      -5
      -6
      -7
      Symbol
      Parameter
      Min.
      Max.
      Min.
      Max.
      Min.
      Max
      Units
      t
      CK
      3
      t
      CK
      2
      t
      AC
      3
      t
      AC
      2
      t
      CHI
      t
      CL
      t
      OH
      t
      LZ
      t
      HZ
      3
      t
      HZ
      2
      t
      DS
      t
      DH
      t
      AS
      t
      AH
      t
      CKS
      t
      CKH
      t
      CKA
      t
      CS
      t
      CH
      t
      RC
      t
      RAS
      t
      RP
      t
      RCD
      t
      RRD
      t
      DPL
      Clock Cycle Time
      CAS
      Latency = 3
      CAS
      Latency = 2
      CAS
      Latency = 3
      CAS
      Latency = 2
      5
      7
      2
      2
      2
      0
      2
      1
      2
      1
      2
      1
      4.5
      5
      4.5
      5
      6
      8
      2
      2
      2
      0
      2
      1
      2
      1
      2
      1
      5.5
      6
      5.5
      6
      7
      6
      6
      6
      6
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      ns
      8.6
      2.5
      2.5
      2
      0
      2
      1
      2
      1
      2
      1
      Access Time From CLK
      (4)
      CLK HIGH Level Width
      CLK LOW Level Width
      Output Data Hold Time
      Output LOW Impedance Time
      Output HIGH Impedance Time
      (5)
      CAS
      Latency = 3
      CAS
      Latency = 2
      Input Data Setup Time
      Input Data Hold Time
      Address Setup Time
      Address Hold Time
      CKE Setup Time
      CKE Hold Time
      CKE to CLK Recovery Delay Time
      Command Setup Time (
      CS
      ,
      RAS
      ,
      CAS
      ,
      WE
      , DQM)
      Command Hold Time (
      CS
      ,
      RAS
      ,
      CAS
      ,
      WE
      , DQM)
      Command Period (REF to REF / ACT to ACT)
      Command Period (ACT to PRE)
      Command Period (PRE to ACT)
      Active Command To Read / Write Command Delay Time
      Command Period (ACT [0] to ACT[1])
      Input Data To Precharge
      Command Delay time
      Input Data To Active / Refresh
      Command Delay time (During Auto-Precharge)
      t
      T
      Transition Time
      t
      REF
      Refresh Cycle Time (4096)
      1CLK+3
      2
      1
      50
      30
      15
      15
      10
      2CLK
      1CLK+3
      2
      1
      60
      36
      18
      18
      12
      2CLK
      1CLK+3
      2
      1
      70
      42
      21
      21
      14
      2CLK
      100,000
      100,000
      100,000
      t
      DAL
      2CLK+t
      RP
      2CLK+t
      RP
      2CLK+t
      RP
      ns
      1
      10
      64
      1
      10
      64
      1
      10
      64
      ns
      ms
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