參數(shù)資料
型號: HTMS1301FTB
廠商: NXP Semiconductors N.V.
元件分類: 通信及網(wǎng)絡(luò)
英文描述: ISO 18000 transponder IC
封裝: HTMS1301FTB/AF<sot1122 (XSON3)|<<http://www.nxp.com/packages/sot1122.html<1<Always Pb-free,;HTMS1301FUG/AM<Uncased die|<<<1<Always Pb-free,;HTMS8301FTB/AF<sot1122
文件頁數(shù): 9/44頁
文件大?。?/td> 719K
代理商: HTMS1301FTB
184430
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.0 — 18 March 2010
184430
9 of 44
NXP Semiconductors
HITAG μ
ISO 18000 transponder IC
10. HITAG
μ
ISO 18000 transponder IC air interface
10.1 Downlink communication signal interface - RWD to HITAG
μ
ISO 18000 transponder IC
10.1.1
Modulation parameters
Communications between RWD and HITAG μ ISO 18000 transponder IC takes place
using ASK modulation with a modulation index of m > 90%.
Table 5.
[1]
T
Fd0
> T
F1
+ T
F3
+ 3
×
T
c
T
C...
Carrier period time (
1/
125
kHz
= 8
μ
s nominal)
[2]
Fig 3.
Modulation details of data transmission from RWD to HITAG μ transponder IC
Modulation coding times
[1][2]
Symbol
Min
Max
m = (a-b)/(a+b)
90%
4
×
T
c
0
100%
10
×
T
c
0.5
×
T
F1
0.5
×
T
Fd0
0.05
×
a
0.05
×
a
T
F1
T
F2
T
F3
x
0
0
y
0
001aaj826
T
F2
T
F1
T
F3
b
x
a
envelope of transceiver field
y
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