參數(shù)資料
型號(hào)： HTMS1101FUG
廠商： NXP Semiconductors N.V.
元件分類： 通信及網(wǎng)絡(luò)
英文描述： HITAG ?; Transponder IC
封裝： HTMS1001FTB/AF<sot1122 (XSON3)|<<http://www.nxp.com/packages/sot1122.html<1<Always Pb-free,;HTMS1001FTK/AF<SOT899-1 (HVSON2)|<<http://www.nxp.com/packages/SOT899-1.html&l
文件頁數(shù)： 7/58頁
文件大?。?/td> 844K
代理商： HTMS1101FUG
152931
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 January 2010
152931
7 of 58
NXP Semiconductors
HITAG μ
Transponder IC
6.
Mechanical specification
6.1 Wafer specification
See
Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”
.
6.1.1
Wafer
Designation:
each wafer is scribed with batch number and
wafer number
200 mm (8”)
150
μ
m ± 15
μ
m
CMOS 0.14 μm
25 wafers
91981
Diameter:
Thickness:
Process:
Batch size:
PGDW:
6.1.2
Wafer backside
Material:
Treatment:
Roughness:
Si
ground and stress release
R
a
max. 0.5
μ
m, R
t
max. 5
μ
m
6.1.3
Chip dimensions
Die size without scribe:
Scribe line width:
X-dimension:
550
μ
m x 550
μ
m = 302500
μ
m
2
15
μ
m (scribe line width is measured between
nitride edges)
15
μ
m (scribe line width is measured between
nitride edges)
5
Y-dimension:
Number of pads:
6.1.4
Passivation on front
Type:
Material:
Thickness:
sandwich structure
PE-Nitride (on top)
1.75
μ
m total thickness of passivation
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HTMS8001FTK HITAG ?; Transponder IC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HTMS1101FUG/AM,005 功能描述:RFID應(yīng)答器 HITAG transponder IC RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTMS-110-21-H-D 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 20 POS 1.27MM SLDR ST TH - Bulk
HTMS-110-21-H-S 制造商:Samtec Inc 功能描述:.050'' MICRO STRIPS - Bulk
HTMS-110-21-S-D 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 20 POS 1.27MM SLDR ST TH - Bulk
HTMS-110-21-S-S 制造商:Samtec Inc 功能描述:.050'' MICRO STRIPS - Bulk
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