參數(shù)資料
型號(hào)： HTMS1001FUG
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 通信及網(wǎng)絡(luò)
英文描述： HITAG ?; Transponder IC
封裝： HTMS1001FTB/AF<sot1122 (XSON3)|<<http://www.nxp.com/packages/sot1122.html<1<Always Pb-free,;HTMS1001FTK/AF<SOT899-1 (HVSON2)|<<http://www.nxp.com/packages/SOT899-1.html&l
文件頁(yè)數(shù)： 8/58頁(yè)
文件大小： 844K
代理商： HTMS1001FUG
152931
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 January 2010
152931
8 of 58
NXP Semiconductors
HITAG μ
Transponder IC
6.1.5
Au bump
Bump material:
Bump hardness:
Bump shear strength:
Bump height:
Bump height uniformity:
–
within a die:
–
within a wafer:
–
wafer to wafer:
Bump flatness:
Bump size:
–
LA, LB
–
TEST, GND, VDD
–
Bump size variation:
Under bump metallization:
> 99.9% pure Au
35 – 80 HV 0.005
> 70 MPa
18
μ
m
± 2
μ
m
± 3
μ
m
± 4
μ
m
± 1.5
μ
m
294 x 164
μ
m
60 x 60
μ
m
±
5
μ
m
sputtered TiW
6.1.6
Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See
Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”
.
6.1.7
Map file distribution
See
Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”
.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HTMS1001FUG/AM,005 功能描述:RFID應(yīng)答器 Smart Label/Tag Ics RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTMS-101-01-G-D 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 2 POS 1.27MM SLDR ST TH - Bulk 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, VERTICAL THT, 2WAY 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, VERTICAL THT, 2POS; Series:HTMS; Pitch Spacing:1.27mm; No. of Rows:2; No. of Contacts:2; Gender:Header; Contact Termination:Through Hole Vertical; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
HTMS-101-01-G-D-RA 制造商:Samtec Inc 功能描述:.050'' MICRO STRIPS - Bulk 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, THT, R/A, 2WAY 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, THT, R/A, 2POS; Series:HTMS; Pitch Spacing:1.27mm; No. of Rows:2; No. of Contacts:2; Gender:Header; Contact Termination:Through Hole Right Angle; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
HTMS-101-01-G-S 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 1 POS SLDR ST TH - Bulk 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, VERTICAL THT, 1WAY 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, VERTICAL THT, 1POS; Series:HTMS; Pitch Spacing:1.27mm; No. of Rows:1; No. of Contacts:1; Gender:Header; Contact Termination:Through Hole Vertical; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
HTMS-101-01-G-S-RA 制造商:Samtec Inc 功能描述:.050'' MICRO STRIPS - Bulk 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, THT, R/A, 1WAY 制造商:Samtec Inc 功能描述:HEADER, 1.27MM, THT, R/A, 1POS; Series:HTMS; Pitch Spacing:1.27mm; No. of Rows:1; No. of Contacts:1; Gender:Header; Contact Termination:Through Hole Right Angle; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
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