參數資料
型號： HS9-80C86RH-Q
廠商： INTERSIL CORP
元件分類： 微控制器/微處理器
英文描述： Radiation Hardened 16-Bit CMOS Microprocessor
中文描述： 16-BIT, 5 MHz, MICROPROCESSOR, CDFP42
封裝： METAL SEALED, CERAMIC, DFP-42
文件頁數： 36/37頁
文件大小： 239K
代理商： HS9-80C86RH-Q
891
Spec Number
518055
HS-80C86RH
D40.6
MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C)
40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.225
-
5.72
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
2.096
-
53.24
4
E
0.510
0.620
12.95
15.75
4
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
-
eA/2
0.300 BSC
7.62 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.070
0.38
1.78
5
S1
0.005
-
0.13
-
6
S2
α
0.005
90
o
-
0.13
90
o
-
7
105
o
105
o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
40
40
8
Rev. 0 4/94
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
PLANE
BASE
PLANE
D
S
S
-D-
-A-
-C-
e
A
-B-
aaa
C A - B
M
D
S
S
ccc
C A - B
M
D
S
S
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
e
A/2
S2
M
A
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
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PDF描述
HS9-80C86RH Radiation Hardened 16-Bit CMOS Microprocessor
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