參數(shù)資料
型號(hào): HS1B-6254RH-Q
廠商: Intersil Corporation
英文描述: Radiation Hardened Ultra High Frequency NPN Transistor Array
中文描述: 輻射加固超高頻NPN晶體管陣列
文件頁(yè)數(shù): 3/3頁(yè)
文件大?。?/td> 31K
代理商: HS1B-6254RH-Q
3
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
52 mils x 52.8 mils x 15 mils
±
1 mil
1320
μ
m x 1340
μ
m x 381
μ
m
±
25.4
μ
m
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 4k
±
0.5k
Top Metallization:
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
±
0.5k
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16k
±
0.8k
Substrate:
UHF-1X Bonded Wafer, DI
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Floating
ADDITIONAL INFORMATION:
Worst Case Current Density:
3.04 x 10
5
A/cm
2
Transistor Count:
5
Metallization Mask Layout
HS-6254RH
NOTE: Pad numbers correspond to the 16 lead pinout.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
HS-6254RH
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