參數(shù)資料
型號: HD64F2376
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù): 30/67頁
文件大?。?/td> 382K
代理商: HD64F2376
Rev. 2.0, 03/06/02, 27
2.6.3
Stopping a Build
The Hitachi Embedded Workshop allows you to halt the build process.
To stop a build:
1. Select [Build->Stop Build] or click the stop build toolbar button (
). The build will be stop after the
current file has been built.
2. Wait until the message “Build Finished” appears in the “Output” window before continuing.
To forcibly terminate a current tool
1. Select [Build->Terminate Current Tool]. The HEW will attempt to stop the tool immediately.
Note:
Do NOT assume that any output from the tool you terminated is valid. It is recommended that you delete
any output files produced and ensure that the phase is executed again.
2.6.4
Building Multiple Projects
The Hitachi Embedded Workshop lets you build multiple projects and configurations at once.
To build multiple projects:
1.
Select [Build->Build Multiple]. The figure displayed in figure 2.18.
2.
The build multiple gives you the choice of which projects and configurations should be built. To select
which projects and configurations need to be built select the check box next to the project –
configuration combination you want to build. For example, in figure 2.18 if you wanted to build the
entire “hewtest2” project you would check the “hewtest2-Debug” and the “hewtest2-Release” selections
and leave all other check boxes unchecked.
3.
When you are happy with your chosen selection click the build button and the HEW will then build the
projects and configurations you have chosen.
4.
If you want to build all the projects which you choose, you click the build all button.
5.
Results from the build are displayed in the build window in the same way as the normal build process.
Figure 2.18: Build Multiple Dialog
相關(guān)PDF資料
PDF描述
HD64F2376R Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2377 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2377R Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2398 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2506 Single-Chip Microcomputer H8S Series Technical Q&A
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2377RVFQ33 功能描述:IC H8S MCU FLASH 384K 144-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設(shè)備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB(384K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2377RVFQ33W 功能描述:IC H8S MCU FLASH 384K 144-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設(shè)備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB(384K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2378AVFQ34V 制造商:Renesas Electronics Corporation 功能描述:H8S/23 FLASH 512K/32K FP-144H - Trays 制造商: 功能描述: 制造商:undefined 功能描述:
HD64F2378RVFQ34 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 512K 144-LQFP - Trays
HD64F2378RVFQ34V 功能描述:IC H8S MCU FLASH 512K 144LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準(zhǔn)包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C,IrDA,SPI,UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位,DMA,POR,PWM,WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB(96K x 16) 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM