參數(shù)資料
型號： HC55130IBZ96
廠商： INTERSIL CORP
元件分類： 模擬傳輸電路
英文描述： Low Power Universal SLIC Family
中文描述： TELECOM-SLIC, PDSO28
封裝： ROHS COMPLIANT, PLASTIC, MS-013-AE, SOIC-28
文件頁數(shù)： 4/36頁
文件大?。?/td> 701K
代理商： HC55130IBZ96
4
FN4659.13
June 1, 2006
Absolute Maximum Ratings
T
A
= 25°C
Temperature, Humidity
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C
Operating Temperature Range. . . . . . . . . . . . . . . .-40°C to 110°C
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C
Power Supply (-40°C
≤
T
A
≤
85°C)
Supply Voltage V
CC
to GND . . . . . . . . . . . . . . . . . . . .-0.4V to 7V
Supply Voltage V
BL
to GND. . . . . . . . . . . . . . . . . . . .-V
BH
to 0.4V
Supply Voltage V
BH
to GND, Continuous . . . . . . . . .-75V to 0.4V
Supply Voltage V
BH
to GND, 10ms . . . . . . . . . . . . . .-80V to 0.4V
Relay Driver
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to V
CC
Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to V
CC
Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes
Tipx and Ringx Terminals (-40°C
≤
T
A
≤
85°C)
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA
Thermal Information
Thermal Resistance (Typical, Note 1)
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
Continuous Power Dissipation at 85°C
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . . . . . 300°C
(PLCC, SOIC - Lead Tips Only)
θ
JA
52°C/W
45°C/W
66.2°C/W
Derate above 70°C
Tip and Ring Terminals
Tipx or Ringx, Current, Pulse < 10ms, T
REP
> 10s . . . . . . . . . .2A
Tipx or Ringx, Current, Pulse < 1ms, T
REP
> 10s . . . . . . . . . . .5A
Tipx or Ringx, Current, Pulse < 10
μ
s, T
REP
> 10s . . . . . . . . .15A
Tipx or Ringx, Current, Pulse < 1
μ
s, T
REP
> 10s . . . . . . . . . .20A
Tipx or Ringx, Pulse < 250ns, T
REP
> 10s
20A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Typical Operating Conditions
These represent the conditions under which the device was developed and are suggested as guidelines.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Ambient Temperature
HC55120, HC55150/1
0
-
70
°C
HC55121, HC55130/1, HC55140/1,
HC55142/3
-40
-
85
°C
V
BH
with Respect to GND
-58
-
-8
V
V
BL
with Respect to GND
V
BH
-
0
V
V
CC
with Respect to GND
4.75
-
5.25
V
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
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