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參數(shù)資料
| 型號： | HC55130IBZ96 |
| 廠商： | INTERSIL CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | Low Power Universal SLIC Family |
| 中文描述： | TELECOM-SLIC, PDSO28 |
| 封裝： | ROHS COMPLIANT, PLASTIC, MS-013-AE, SOIC-28 |
| 文件頁數(shù)： | 34/36頁 |
| 文件大小： | 701K |
| 代理商： | HC55130IBZ96 |
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34
FN4659.13
June 1, 2006
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
Small Outline Plastic Packages (SOIC)
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
M28.3
(JEDEC MS-013-AE ISSUE C
)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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| HC55130IMZ | Low Power Universal SLIC Family |
| HC55140IBZ | Low Power Universal SLIC Family |
| HC55140IMZ | Low Power Universal SLIC Family |
| HC55142IBZ | Low Power Universal SLIC Family |
| HC55142IM96 | Low Power Universal SLIC Family |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HC55130IM | 制造商:Rochester Electronics LLC 功能描述:LOW PWR SLIC,63DB BALANCE - Bulk 制造商:Harris Corporation 功能描述: |
| HC55130IMZ | 功能描述:電信線路管理 IC LW PWR SLIC 63DB BALANCE RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| HC55131 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Power Universal SLIC Family |
| HC55131IM | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Power Universal SLIC Family |
| HC5513BIM | 功能描述:IC SLIC DLC/FLC LP STDBY 22-DIP RoHS:否 類別:集成電路 (IC) >> 接口 - 電信 系列:UniSLIC14 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 06/Feb/2012 標(biāo)準(zhǔn)包裝:750 系列:* |
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