參數(shù)資料
型號(hào)： HC55120CMZ
廠商： INTERSIL CORP
元件分類： 模擬傳輸電路
英文描述： Low Power Universal SLIC Family
中文描述： TELECOM-SLIC, PQCC28
封裝： ROHS COMPLIANT, PLASTIC, MS-018AB, LCC-28
文件頁(yè)數(shù)： 36/36頁(yè)
文件大?。?/td> 701K
代理商： HC55120CMZ
36
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4659.13
June 1, 2006
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.015 (0.38)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
PIN (1)
IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.050 (1.27)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
NE
ND
(0.12)
0.005
M
D S
- B S
A S
0.042 (1.07)
0.048 (1.22)
N32.45x55
(JEDEC MS-016AE ISSUE A)
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.125
0.140
3.18
3.55
-
A1
0.060
0.095
1.53
2.41
-
D
0.485
0.495
12.32
12.57
-
D1
0.447
0.453
11.36
11.50
3
D2
0.188
0.223
4.78
5.66
4, 5
E
0.585
0.595
14.86
15.11
-
E1
0.547
0.553
13.90
14.04
3
E2
0.238
0.273
6.05
6.93
4, 5
N
28
28
6
ND
7
7
7
NE
9
9
7
Rev. 0 7/98
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimen-
sions are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic
body.
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
contact point.
-C-
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HC55121 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Power Universal SLIC Family
HC55121IB 制造商:Rochester Electronics LLC 功能描述:LOW POWER,SLIC,POL/REV/METERING,5301B BALANCE - Bulk
HC55121IBZ 功能描述:電信線路管理 IC LW PWR SLIC POL/REV/MTRING 5301B RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
HC55121IM 制造商:Rochester Electronics LLC 功能描述:LOW PWR SLIC,POL REV/METERING,53DB BALANCE - Bulk
HC55121IMZ 功能描述:電信線路管理 IC LW PWR SLIC POLV/MTRING 53DB RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray
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