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參數(shù)資料
| 型號(hào)： | GP1S096HCZ0F |
| 廠商： | Sharp Microelectronics |
| 文件頁(yè)數(shù)： | 7/9頁(yè) |
| 文件大?。?/td> | 137K |
| 描述： | SENSOR OPTO SLOT 1MM TRANS THRU |
| 產(chǎn)品變化通告： | Internal Chip Change 04/May/2007 |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 檢測(cè)距離： | 0.039"（1mm） |
| 檢測(cè)方法： | 可傳導(dǎo)的 |
| 輸出配置： | 光電晶體管 |
| 電流 - DC 正向(If)： | 50mA |
| 電流 - 集電極 (Ic)（最大）： | 20mA |
| 電壓 - 集電極發(fā)射極擊穿（最大）： | 35V |
| 響應(yīng)時(shí)間： | 50µs，50µs |
| 安裝類型： | 通孔 |
| 封裝/外殼： | PCB 安裝 |
| 包裝： | 管件 |
| 類型： | 無(wú)放大 |
| 工作溫度： | -25°C ~ 85°C |
| 產(chǎn)品目錄頁(yè)面： | 2776 (CN2011-ZH PDF) |
| 其它名稱： | 425-1965-5 |
7
Sheet No.: D3-A00901EN
GP1S096HCZ0F
?SPAN class="pst GP1S096HCZ0F_2586985_4">Manufacturing Guidelines
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Soldering Method
Flow Soldering:
Soldering should be completed below 260贑 and within 5 s.
Please solder within one time.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by re ow.
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350
C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
?/DIV>
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45贑 or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
?/DIV>
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Speci c brominated ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| GP1S097HCZ | 功能描述:PHOTOINTERRUPTER SLOT 2.0MM PCB RoHS:否 類別:傳感器，轉(zhuǎn)換器 >> 光學(xué) - 光斷續(xù)器 - 槽型 - 晶體管輸出 系列:- 產(chǎn)品變化通告:Internal Chip Change 04/May/2007 標(biāo)準(zhǔn)包裝:100 系列:- 檢測(cè)距離:0.063"（1.6mm） 檢測(cè)方法:可傳導(dǎo)的 輸出配置:光電晶體管 電流 - DC 正向(If):50mA 電流 - 集電極 (Ic)（最大）:20mA 電壓 - 集電極發(fā)射極擊穿（最大）:35V 響應(yīng)時(shí)間:35µs，35µs 安裝類型:通孔 封裝/外殼:PCB 安裝 包裝:管件 類型:無(wú)放大 工作溫度:-25°C ~ 85°C 其它名稱:425-1978-5 |
| GP1S097HCZ0F | 功能描述:光學(xué)開關(guān)（透射型，光電晶體管輸出） Photointerrupter Sub mini 2.0mm gap RoHS:否 制造商:Omron Electronics 輸出設(shè)備:Phototransistor 槽寬:3.4 mm 光圈寬度:0.5 mm 集電極—發(fā)射極最大電壓 VCEO:30 V 最大集電極電流:20 mA 正向電流: 安裝風(fēng)格:Through Hole 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 封裝: |
| GP1S10 | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:Photointerrupter with Dust Cover |
| GP1S11 | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:LINEAR OUTPUT TYPE PHOTOINTERRUPTER |
| GP1S12 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述: |
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