參數(shù)資料
型號(hào)： EFM32GG290F512
廠商： Energy Micro
文件頁數(shù)： 64/70頁
文件大?。?/td> 0K
描述： IC MCU 32BIT 512KB FLASH BGA112
標(biāo)準(zhǔn)包裝： 1,000
系列： Giant Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 48MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 90
程序存儲(chǔ)器容量： 512KB（512K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 128K x 8
電壓 - 電源 (Vcc/Vdd)： 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 112-LFBGA
包裝： 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32GG290FXX - d0037_Rev1.10
67
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32GG290 Memory Map with largest RAM and Flash sizes ........................................................................ 9
3.1. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.2. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.3. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.4. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.5. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.6. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.7. Calibrated LFRCO Frequency vs Temperature and Supply Voltage ................................................................ 23
3.12. Integral Non-Linearity (INL) ................................................................................................................... 30
3.13. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.14. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.15. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.16. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.17. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.19. ADC Temperature sensor readout ......................................................................................................... 36
3.20. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.21. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.22. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 40
3.23. OPAMP Voltage Noise Spectral Density (Unity Gain) Vout=1V ..................................................................... 40
3.24. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.25. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32GG290 Pinout (top view, not to scale) ............................................................................................. 45
4.2. Opamp Pinout ...................................................................................................................................... 56
4.3. BGA112 .............................................................................................................................................. 56
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 58
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 59
5.3. BGA112 PCB Stencil Design ................................................................................................................... 60
6.1. Example Chip Marking ........................................................................................................................... 61
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32GG290F512-BGA112 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 512KB FLASH 112BGA
EFM32GG290F512-BGA112T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GIANT GECKO - Trays
EFM32GG290F512-BGA112-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 512KB FLASH 112BGA
EFM32GG290F512-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 512KB FLASH 112BGA
EFM32GG295F1024 功能描述:ARM微控制器 - MCU 1024KB FL 128KB RAM RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
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