參數(shù)資料
型號(hào): EDE5108AHSE-6E-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 64M X 8 DDR DRAM, 0.45 ns, PBGA60
封裝: ROHS COMPLIANT, FBGA-60
文件頁(yè)數(shù): 24/64頁(yè)
文件大?。?/td> 871K
代理商: EDE5108AHSE-6E-E
Datasheet
DD2.x
PowerPC 750CL Microprocessor
Preliminary
Dimensions and Signal Assignments
Page 30 of 65
750cl_ds_body.fm.2.4
May 29, 2007
4. Dimensions and Signal Assignments
IBM offers a flip chip plastic ball grid array (FCPBGA) that supports 278 balls for the 750CL package. This is
a signal and power compatible footprint to the PowerPC 750GX RISC microprocessor module. The 750CL
pinout, power dissipation, timing, and signal definitions are not completely identical to the 750GX. See
PowerPC 750CL DD1.2 Differences from 750GX Application Note for details.
4.1 Package
4.1.1 Overview
FCPBGA packages are suited for applications requiring much higher I/O counts and better electrical perfor-
mance than that offered by enhanced plastic ball grid array (EPBGA) and high-performance ball grid array
(HPBGA) packages. They are recommended for applications having medium electrical performance and
power dissipation requirements.
4.1.2 Features
Low dielectric-constant organic build-up substrate
Flip chip die attach; BGA second-level interconnect
Two-layer core
JEDEC-compliant packages
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