品牌 | st | 型號 | db3 |
封裝形式 | 直插型 | 裝配方式 | 有引線表面組裝 |
封裝材料 | 玻璃封裝 | 結(jié)構(gòu) | 點(diǎn)接觸型 |
材料 | 硅 | 頻率特性 | 低頻 |
功率特性 | 小功率 | 耐壓等級 | 20~60(v) |
正向工作電流 | 2.0(a) | 最高反向電壓 | 32(v) |
反向飽和漏電流 | 10(μa) | 營銷方式 | 直銷 |
應(yīng)用范圍 | 觸發(fā) |
electrical characteristics(tj = 25°c unless otherwise specified)
symbol | parameter | test conditions | smdb3 | db3 | db4 | unit | |
vbo | breakover voltage * | c = 22nf ** | min. | 28 | 28 | 35 | v |
typ. | 32 | 32 | 40 | ||||
max. | 36 | 36 | 45 | ||||
ivbo1-vbo2i | breakover voltage symmetry | c = 22nf ** | max. | 3 | v | ||
dv | dynamic breakover voltage * | vboand vfat 10ma | min. | 10 | 5 | v | |
vo | output voltage * | see diagram 2 (r=20w) | min. | 10 | 5 | v | |
ibo | breakover current * | c = 22nf ** | max. | 10 | 50 | ma | |
tr | rise time * | see diagram 3 | max. | 0.50 | 2 | ms | |
ir | leakage current * | vr= 0.5 vbomax | max. | 1 | 10 | ma | |
ip | peak current * | see diagram 2 (gate) | min. | 1 | 0.30 | a |
* applicable to both forward and reverse directions.
** connected in parallel to the device.
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